WMSIC Electronic Components

TAIYO YUDEN MEASE063BB5105MF1B33

ModelMEASE063BB5105MF1B33
Package0201
BrandTAIYO YUDEN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
TAIYO YUDEN MEASE063BB5105MF1B33
Type
TAIYO YUDEN
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TAIYO YUDEN
Electronic Component
MEASE063BB5105MF1B33
Electronic Component
1
Electronic Component
1uF
Package
0201
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±20%
Electronic Component
0.009g
Electronic Component
1
Electronic Component
BM0263672675
Electronic Component
X5R
Voltage
16V
Electronic Component
Electronic Component
Electronic Component
15000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TAIYO YUDEN MEASE063BB5105MF1B33 多层陶瓷电容器(MLCC)产品概述

一、产品基本属性与核心规格

MEASE063BB5105MF1B33是TAIYO YUDEN(太诱)推出的表面贴装多层陶瓷电容器(SMD/SMT MLCC),专为移动设备等紧凑电子系统设计。其核心规格明确,覆盖主流低电压电路需求:

  • 容值:1μF(型号中“105”对应10×10⁵ pF),精度±20%;
  • 额定电压:16V(直流),满足移动设备3.7V/5V供电电路的安全裕量;
  • 温度系数:X5R,工作温度范围-55℃~+85℃,容值变化率±15%(符合EIA标准);
  • 封装:0201(英制)/0603(公制),尺寸0.6mm×0.3mm×0.3mm(典型值),属于小型化贴装封装;
  • 品牌:TAIYO YUDEN(太诱),日系被动元件厂商,以MLCC可靠性著称。

二、关键技术特性解析

  1. 温度稳定性适配复杂环境
    X5R温度系数是核心优势:相较于Y5V等低稳定性系数,该产品在-55℃(户外低温)至+85℃(充电/高负载发热)范围内,容值波动控制在±15%以内,避免电路性能漂移,适配移动设备的宽温度场景。

  2. 小封装高密度布局
    0201封装体积仅为0603封装的1/4,可显著提升PCB布局密度,满足智能手机“轻薄化”设计需求,同时降低整机体积与重量。

  3. 电压与精度的平衡设计
    16V额定电压覆盖绝大多数移动设备电路(如LDO输出、充电电路滤波);±20%精度虽非高精度,但足以满足滤波、耦合、去耦等常规功能,且成本更具竞争力。

三、典型应用场景

该产品定位明确指向移动终端设备,主要应用场景包括:

  • 智能手机/平板电脑:LDO稳压器输出滤波、射频前端(RF Front-end)去耦、音频电路耦合;
  • 穿戴设备:智能手表/手环的PMU滤波、传感器信号耦合;
  • 无线模块:蓝牙/WiFi/NFC模块的电源去耦与信号滤波;
  • 便携式电子:移动电源、蓝牙耳机的内部电路滤波。

四、可靠性与生产适配性

太诱的工艺优势保障了产品可靠性:

  • 焊接兼容性:支持无铅回流焊,耐温符合J-STD-020标准,适配标准SMT生产线;
  • 机械强度:多层陶瓷结构+优化电极设计,抗弯折、抗振动性能优异,应对移动设备跌落/晃动场景;
  • 电气性能优化:低漏电特性适合电源滤波,ESR(等效串联电阻)、ESL(等效串联电感)参数优化,高频下滤波效果稳定。

五、市场价值与定位

MEASE063BB5105MF1B33是移动设备领域的高性价比MLCC,核心价值点:

  • 成本控制:±20%精度与X5R系数的平衡,满足功能需求的同时降低成本,适合中低端至中端移动设备批量采购;
  • 供应链稳定:太诱量产能力与全球供应网络,保障终端厂商持续供货;
  • 品牌背书:日系厂商质量可靠性,减少售后故障率,提升用户体验。

综上,该产品凭借小封装、稳定特性与场景适配性,成为移动设备电源与信号电路的常用被动元件选择。

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