WMSIC Electronic Components

TAIYO YUDEN EMK063AC6104KP-F EMK063AC6104KP

ModelEMK063AC6104KP-F
Package0201
BrandTAIYO YUDEN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
TAIYO YUDEN EMK063AC6104KP-F
Type
TAIYO YUDEN
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TAIYO YUDEN
Electronic Component
EMK063AC6104KP-F
Electronic Component
1
Electronic Component
100nF
Package
0201
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.009g
Electronic Component
1
Electronic Component
BM0263672680
Electronic Component
X6S
Voltage
16V
Electronic Component
Electronic Component
Electronic Component
15000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TAIYO YUDEN EMK063AC6104KP-F 多层陶瓷贴片电容(MLCC)产品概述

一、产品基本属性

EMK063AC6104KP-F是日本太诱(TAIYO YUDEN)推出的中温稳定型多层陶瓷贴片电容(MLCC),核心定位为小型化、高可靠电子设备的通用滤波/去耦元件。该型号针对消费电子、智能穿戴等对体积和温度稳定性要求较高的场景设计,是太诱经典MLCC系列中的高性价比主力型号。

二、核心技术参数详解

该型号的关键参数完全覆盖通用低压电路需求,具体如下:

  1. 容值与精度:标称容值为100nF(104),容量精度±10%,实际容值范围90nF~110nF,满足多数信号滤波、电源去耦的容值要求;
  2. 额定电压:直流额定电压16V,适配3.3V、5V等低压系统,交流应用需注意峰值电压不超过额定值;
  3. 温度特性(X6S):符合EIA标准的X6S温度系数,工作温度范围**-55℃~+105℃**,此范围内容量变化率≤±22%,温度稳定性优于X5R类电容;
  4. 辅助参数:1kHz下损耗角正切(tanδ)≤0.15,25℃时绝缘电阻≥10⁶ MΩ·μF(10V DC),低损耗、高绝缘特性适配信号电路。

三、封装与物理特性

该型号采用0201英制封装(对应公制0603),是电子设备小型化的主流封装之一:

  1. 尺寸规格:典型尺寸为长0.6±0.05mm × 宽0.3±0.05mm × 厚0.3±0.05mm,体积仅为0204封装的1/3,可显著提升PCB布局密度;
  2. 端电极设计:采用Ni(镍)/Sn(锡)双层无铅镀层,焊接兼容性优异,支持回流焊、波峰焊等常规工艺,焊点可靠性符合IPC标准;
  3. 环保合规:完全符合欧盟RoHS指令(2011/65/EU)及REACH法规,不含铅、镉等有害物质,满足全球市场环保要求。

四、适用场景与应用优势

4.1 典型应用场景

  • 消费电子:智能手机射频前端滤波、蓝牙耳机电源去耦、平板电视信号调理;
  • 智能穿戴:智能手表/手环传感器信号滤波、低功耗电源耦合;
  • 小型工业设备:微型传感器模块、工业控制板信号滤波;
  • 便携式医疗:血糖仪、血压计低功耗电路耦合。

4.2 核心优势

  1. 宽温稳定:X6S特性确保-55℃~+105℃内容量波动小,避免温度变化导致电路性能下降;
  2. 高密度布局:0201封装适配智能手机、智能穿戴等空间苛刻的设备;
  3. 高可靠性:太诱多层陶瓷工艺经严格测试,可长期稳定工作在恶劣环境;
  4. 成本效益:通用型设计兼顾性能与成本,适合批量应用。

五、质量与可靠性说明

太诱对该型号实施全流程质量管控:

  1. 可靠性测试:出厂前通过高温存储(125℃×1000h)、温度循环(-55℃~+125℃×1000次)、湿度测试(85℃/85%RH×1000h)等;
  2. 工艺一致性:自动化生产确保容值、尺寸一致性,避免批量应用差异;
  3. 行业认证:部分批次符合AEC-Q200标准,可拓展至高可靠工业场景。

该型号凭借小型化、宽温稳定、高可靠特性,成为消费电子及智能穿戴领域的主流选择,满足多数低压通用电路的电容需求。

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