WMSIC Electronic Components

TAIYO YUDEN UMK105B7102KVHF

ModelUMK105B7102KVHF
Package0402
BrandTAIYO YUDEN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TAIYO YUDEN UMK105B7102KVHF
Type
TAIYO YUDEN
Unit
Electronic Component
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TAIYO YUDEN
Electronic Component
UMK105B7102KVHF
Electronic Component
1
Electronic Component
1nF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.011g
Electronic Component
1
Electronic Component
BM0262566848
Electronic Component
X7R
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

UMK105B7102KVHF 产品概述

一、产品简介

UMK105B7102KVHF 为 TAIYO YUDEN(太诱)出品的片式多层陶瓷电容(MLCC),额定电压 50V,标称电容 1nF(102),容差 ±10%(K),介质类别 X7R,封装 0402(公制 1005/英制 0402)。此型号面向高密度贴片电路,兼顾体积最小化与通用电性能。

二、主要规格

  • 容值:1nF(±10%)
  • 额定电压:50V DC
  • 介质:X7R(-55℃ ~ +125℃,温度下容量变化受限)
  • 封装:0402(适合高密度 SMT)
  • 适用温度范围与耐压性能以厂方数据为准。

三、特性与优势

  • 小型化封装,便于高密度布板与减小元件占用面积。
  • X7R 类二介质在宽温区间内保持较稳定的电容特性,适合通用旁路、去耦与滤波。
  • MLCC 具有低等效串联电阻(ESR)和低等效串联电感(ESL),对高频性能友好。
  • 品牌质量稳定,适合量产与长期供应。

四、典型应用

  • 电源去耦与旁路(中低频电源轨)
  • 高频滤波与噪声抑制
  • 高频耦合/退耦、振荡与定时电路(需评估容差与温漂)
  • 消费类电子、移动设备、物联网与通信终端的表面贴装场景。

五、使用建议与注意事项

  • 注意 X7R 在直流偏置下会出现一定电容下降,设计时需预留裕量。
  • 0402 体积小,建议走短路径、靠近 IC 引脚放置,并使用适度焊盘以降低热机械应力。
  • 避免在 PCB 焊接或组装过程中发生弯曲应力,以防电容裂纹。
  • 对可靠性要求高的场合,建议做回流焊工艺验证及温度循环测试。
  • 陶瓷电容存在随时间的轻微老化特性(可通过退火改善),长期性能以实际测量为准。

六、包装与采购建议

常见为卷带(Tape & Reel)包装,便于 SMT 贴装。大批量采购时建议向太诱或授权代理确认最小订购量、交期与具体器件数据手册(含温度、偏压依赖曲线与寿命测试数据),以便在设计与生产中获得最佳表现。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.