Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TAIYO YUDEN MSASE105SC6105KFNA01
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- TAIYO YUDEN MSASE105SC6105KFNA01
- Type
- TAIYO YUDEN
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TAIYO YUDEN
- Electronic Component
- MSASE105SC6105KFNA01
- Electronic Component
- 1
- Electronic Component
- 1uF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.012g
- Electronic Component
- 1
- Electronic Component
- BM0227664180
- Electronic Component
- X6S
- Voltage
- 16V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MSASE105SC6105KFNA01 产品概述
一、产品简介
MSASE105SC6105KFNA01 为 TAIYO YUDEN（太诱）生产的片式多层陶瓷电容，容值 1µF，额定电压 16V，精度 ±10%，温度特性为 X6S，封装为 0402（约 1.0 × 0.5 mm）。该型号面向对体积、频率特性和温度稳定性有均衡要求的去耦与旁路应用。
二、主要规格
- 容值：1 µF
- 额定电压：16 V DC
- 公差：±10%
- 介质温度特性：X6S（适用于宽温区间的稳定性）
- 封装：0402（SMD）
- 高温性能：描述中标注工作环境可达 105°C（实际应用请参照厂商完整数据表）
三、电性能特点
该系列电容采用多层陶瓷结构，呈现低等效串联电阻（ESR）与低等效串联电感（ESL），在高频去耦与旁路场景下能快速提供瞬态电流。X6S 介质在低温与高温区域均能保持相对稳定的电容值，适合对温漂有一定要求的电源滤波与模拟电路。
四、封装与装配建议
0402 超小封装适合高密度 PCB 布局。推荐采用标准无铅回流焊工艺，严格遵循制造商回流温度曲线以避免热应力导致裂纹或性能退化。贴装时注意防止机械冲击和过度翻转刮擦。
五、可靠性与存储
此类陶瓷电容具有良好的长期可靠性，但对焊接热冲击与机械应力敏感。建议在干燥环境下保存，必要时遵循湿敏等级（MSL）回流前干燥处理。电容在反复热循环或过压工况下可能出现容值漂移或裂纹，应在设计时留有裕量。
六、典型应用场景
- PCB 电源去耦与旁路
- 电源滤波与稳压器输入/输出耦合
- 移动设备与可穿戴设备中要求小尺寸与稳定性的滤波电容
- 高密度消费电子与通信设备的信号完整性优化
七、选型与采购要点
确认使用环境温度、纹波电流及可允许体积后再选型。0402 尺寸虽节省空间，但对装配和检修要求更高。订购时请核对完整料号与批次信息，参考厂方数据表获取详细的温度特性曲线、最大容许电压随温度的变化以及回流焊工艺参数。
如需进一步的电气参数（如频率响应、等效串联参数、温漂曲线）或 PCB 焊盘推荐尺寸，可提供需求，我将基于厂商资料给出更具体的建议。
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