Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TAIYO YUDEN LMK105BBJ475MVLF
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TAIYO YUDEN LMK105BBJ475MVLF
- Type
- TAIYO YUDEN
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TAIYO YUDEN
- Electronic Component
- LMK105BBJ475MVLF
- Electronic Component
- 1
- Electronic Component
- 4.7uF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±20%
- Electronic Component
- 0.011g
- Electronic Component
- 1
- Electronic Component
- BM0000000018
- Electronic Component
- X5R
- Voltage
- 10V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LMK105BBJ475MVLF 产品概述
LMK105BBJ475MVLF是来自知名品牌太诱（TAIYO YUDEN）的高性能表面贴装多层陶瓷电容器（MLCC），其设计理念是为现代电子产品提供卓越的电气性能和可靠性。这款电容器采用0402（1005公制）封装，具有小巧的体积和卓越的电气特性，适用于各种高频率和高密度应用场合。以下是对该电容器的详细描述和应用场景分析。
基础参数
LMK105BBJ475MVLF的基本电气参数如下：
- 电容值：4.7µF
- 容差：±20%
- 额定电压：10V
- 温度系数：X5R
- 工作温度范围：-55°C至85°C
- 厚度（最大值）：0.55mm
- 封装类型：0402表面贴装
电容器使用了X5R温度特性，这种特性保证了在较大温度范围内维持相对恒定的电容值，适合多种环境条件下的应用。
应用场景
LMK105BBJ475MVLF电容器广泛应用于开关电源（SMPS）及其过滤器设计中。开关电源通常由于频繁的开关动作产生较高的电流和电压瞬态，因此需要高稳定性和低损耗的电容器来提高电源的效率和稳定性。此外，由于其小型封装和高性能，LMK105BBJ475MVLF非常适合用于体积紧凑的电子设备，如：
- 消费电子产品：如智能手机、平板电脑及其他便携式设备。
- 工业电子：在设备控制和信号处理电路中，提供稳定的电压和信号滤波。
- 家用电器：满足现代家电对高效能、高稳定性和小型化的要求。
- 汽车电子：应用于车载电子设备和电控系统中，确保在严酷环境下的可靠工作。
- 医疗设备：提供必要的电气性能以保证设备的安全性和准确性。
电气特性
在电气特性方面，LMK105BBJ475MVLF的4.7µF电容值配合10V的额定电压，能够妥善应对大多数应用所需的电气条件。较大的电容值在需要快速储能和释放电能的场合中表现尤为突出，能够有效滤除高频噪声，提升电源电路的稳定性。
使用X5R温度系数的材料，使得电容器在不同温度变化下表现出低电容变化，相比于其他类型的电容器（例如，Y5V和Z5U），具有更好的温度稳定性和性能可靠性。工作温度范围从-55°C到85°C，满足了不同行业对环境适应性的要求。
结论
综合上述特性，LMK105BBJ475MVLF是一款非常适合现代高科技电子产品的表面贴装多层陶瓷电容器。它在保证小型化设计的同时，提供极佳的电气性能和可靠性，是提高设备性能和效率的不二选择。无论是消费电子、工业自动化还是汽车电子，LMK105BBJ475MVLF都能满足多种应用需求，成为设计工程师们广泛推崇的选择之一。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
