WMSIC Electronic Components

TAIYO YUDEN MSASU105AB5474KFNA01

ModelMSASU105AB5474KFNA01
Package0402
BrandTAIYO YUDEN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
TAIYO YUDEN MSASU105AB5474KFNA01
Type
TAIYO YUDEN
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TAIYO YUDEN
Electronic Component
MSASU105AB5474KFNA01
Electronic Component
1
Electronic Component
470nF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.011g
Electronic Component
1
Electronic Component
BM0263672690
Electronic Component
X5R
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MSASU105AB5474KFNA01 产品概述

一、产品简介

MSASU105AB5474KFNA01 为贴片多层陶瓷电容(MLCC),标称容量 470nF,公差 ±10%,额定电压 50V,介质温度特性为 X5R,封装为 0402(约 1.0 × 0.5mm)。该器件适用于对体积和高度有严格限制的表面贴装电路板,用于旁路、去耦与滤波等常见电容功能。

二、主要特性

  • 容量:470nF,适合中等容量去耦与旁路需求。
  • 精度:±10%,满足一般电源与模拟电路容值稳定性要求。
  • 额定电压:50V,可直接用于中低压电源轨与信号链。
  • 介质:X5R 型(工作温度范围通常至 +85°C),在温度变化下容量有一定漂移但能保持较好体积容量比。
  • 封装:0402 小尺寸,便于高密度 PCB 设计与空间受限应用。

三、典型应用

  • 电源旁路与去耦(DC-DC 输入/输出、微控制器、电源域隔离)。
  • 滤波与耦合网络(模拟前端、信号链滤波)。
  • 便携式设备、消费类电子、物联网终端及一般工业电子设备的高密度布置。

四、设计与封装建议

  • 近源放置:对去耦电容,应靠近 IC 电源脚放置以最小化走线电感与阻抗。
  • 考虑直流偏压效应:X5R 型陶瓷电容在高电场下容量会下降,设计时建议留有裕量并参考厂商 DC-bias 曲线。
  • PCB 封装与回流:按厂家推荐的焊盘尺寸设计,采用标准回流工艺(符合 J-STD-020 峰值温度规范)。0402 体积小,贴装时注意取放吸嘴匹配,避免拉起或偏位。
  • 机械应力防护:MLCC 对弯曲与挤压较敏感,装配与测试过程中应避免 PCB 弯曲和过大机械力。

五、可靠性与使用注意

  • 温度与老化:X5R 有温漂与老化特性,应在电路容差预算中考虑长期容量变化。
  • 焊接与回流:遵循厂商回流温度曲线,防止过热或冷却过快产生裂纹。
  • 检验与筛选:关键应用建议进行外观/电气测试与加速老化筛选,必要时咨询供应商的可靠性数据。

六、订购与支持

MSASU105AB5474KFNA01 常以卷盘(tape & reel)形式供应,购买前请确认包装卷数、环境等级与最新技术资料。设计或批量导入前,建议向 TAIYO YUDEN 获取完整数据手册(含 DC-bias、等效串联电阻与温度曲线)以便精确评估。

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