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TAIYO YUDEN MSASE168BB5106MTNA01
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- TAIYO YUDEN MSASE168BB5106MTNA01
- Type
- TAIYO YUDEN
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TAIYO YUDEN
- Electronic Component
- MSASE168BB5106MTNA01
- Electronic Component
- 1
- Electronic Component
- 10uF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±20%
- Electronic Component
- 0.04g
- Electronic Component
- 1
- Electronic Component
- BM0230670494
- Electronic Component
- X5R
- Voltage
- 16V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MSASE168BB5106MTNA01 产品概述
一、基本参数
MSASE168BB5106MTNA01 是 TAIYO YUDEN（太诱）出品的一款贴片多层陶瓷电容（MLCC），规格为 10µF、额定电压 16V、容差 ±20%、介质类型 X5R，封装尺寸为 0603（公制约 1608）。该型号适合对体积、频率响应和可靠性有中等要求的去耦与旁路场合。
二、主要特性
- 电容量：10µF，适用于中等容量需求的去耦与滤波；
- 额定电压：16V，覆盖常见单电源系统（如 3.3V、5V）及部分模拟电路的旁路；
- 温度特性：X5R 型陶瓷介质，工作温度范围通常为 -55°C 至 +85°C，温度随动较小，适合一般工商业环境；
- 封装优点：0603 小尺寸，有利于高密度布板与减小寄生电感，但对焊接与贴装要求较高。
三、典型应用场景
- 数字电源去耦与电压稳压器输出电容；
- 手机、可穿戴设备等便携式电子产品的滤波与去耦；
- 通信模块、电源管理模块（PMIC）附近的局部去耦；
- 一般消费电子、电路板上中高频滤波用途（非能量储存主电容）。
四、设计与使用建议
- 偏置与温度影响：X5R 陶瓷电容在直流偏置下会出现容量衰减，实际工作容量可能低于标称值，设计时应留有裕量；高温或接近额定电压时衰减更明显；
- 去耦布局：靠近电源引脚放置，尽量缩短引线长度以降低寄生电感；与电感或电阻并联使用时可改善高频响应；
- 电压余量：建议在可靠性或长期稳定性要求较高的场合，不将工作电压长期接近额定 16V，适当留有裕量。
五、封装、焊接与可靠性注意事项
- 0603 封装易受机械应力影响，焊接过程应控制回流曲线，避免过高温度和急冷；
- 推荐使用厂商提供的 PCB 焊盘尺寸和回流规范，以减少裂纹与焊接应力导致的失效；
- 常见可靠性优点包括无极性、低 ESR、耐振动；但对过压、温度循环和焊接应力敏感，需按规范处理。
六、选型与采购建议
在选型时，若电路对容量保持性（尤其在偏置下）要求较高，可考虑增大名义容量或选用更高允许偏置的介质；若关注体积极限且需要更高容量，亦可参考更大尺寸封装。购买与工程设计前，请核对最新官方数据手册，确认温度曲线、偏置特性、最大工作频率与推荐焊盘图，确保满足系统长期可靠性与性能要求。
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