Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
HMK107B7104KAHT 是一款高性能的多层陶瓷电容器(MLCC),专为汽车应用设计,符合 AEC-Q200 车规级标准,确保在严苛环境条件下的稳定性和可靠性。这款电容器的基本参数为:电容值为 0.1µF(100nF),额定电压为 100V,容差为 ±10%。采用了 X7R 温度系数材料,使其在广泛的温度范围内(-55°C 至 125°C)能够提供稳定的电容值。
电容值
本产品的电容值为 0.1µF,适用于高频率电路中的旁路和去耦应用。这种电容值能够有效抑制电源噪声和瞬态电压,帮助提升电路的高频性能。
额定电压和容差
HMK107B7104KAHT 具有 100V 的额定电压,适合于各类电源供应和信号处理电路。此外,±10% 的容差进一步增强了其在各种应用场景中的灵活性。
工作温度范围
该电容器能够在极端温度条件下工作,温度范围为 -55°C 至 125°C,确保在严苛的环境下如汽车电子系统中都能保持优异性能。
安装类型与封装
HMK107B7104KAHT 采用表面贴装(SMD)形式,封装尺寸为 6.0mm x 3.2mm(0603)。这种小型化设计使其适合空间受限的电路板,尤其是在现代电子设备和汽车电子系统中,紧凑的布局至关重要。
特性和优势
这款电容器采用高电压特性,结合 X7R 温度系数材料,使其在各种电气和环境条件下均能保持良好的电容稳定性。高电压和高温特性使其适用于功率管理、控制电路及信号处理等应用。
HMK107B7104KAHT 主要面向汽车电子领域,适合用于车载控制系统、动力系统管理以及信息娱乐系统等多个环节。随着智能汽车和电动汽车的发展,对电子元器件的性能要求越来越高,该电容器的高可靠性、高性能特点正好满足这些需求。
汽车电子
在汽车电子中,这种电容器通常用于车载电脑、传感器和执行机构中的隔离、滤波和去耦处理,有助于提升整车的电气性能与安全性。
工业控制
除了汽车领域外,HMK107B7104KAHT 也可以用于工业设备和控制系统中,如PLC(可编程逻辑控制器)、工业机器人、自动化生产线等。
消费电子
随着智能设备的普及,电子产品对尺寸和性能的要求日益严苛。本电容器的小型化与高性能特性使其能广泛应用于消费电子产品,如智能手机、平板电脑和可穿戴设备等。
总的来说,HMK107B7104KAHT 是一款优秀的车规级多层陶瓷电容器,具备优异的高温稳定性、高电压承受能力和小型化特点。在汽车电子、工业控制和消费电子等领域,它都能提供可靠的电气性能,是设计工程师的理想选择。选择 TAIYO YUDEN 的这款电容器,将为您的项目提供一层坚实的保障,确保产品在市场竞争中脱颖而出。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products