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TAIYO YUDEN LMK212BC6226MG-T LMK212BC6226MG
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- TAIYO YUDEN LMK212BC6226MG-T
- Type
- TAIYO YUDEN
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TAIYO YUDEN
- Electronic Component
- LMK212BC6226MG-T
- Electronic Component
- 1
- Electronic Component
- 22uF
- Package
- 0805
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±20%
- Electronic Component
- 0.043g
- Electronic Component
- 1
- Electronic Component
- BM0257711037
- Electronic Component
- X6S
- Voltage
- 10V
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LMK212BC6226MG-T 产品概述
一、产品简介
LMK212BC6226MG-T 为 0805（2012公制）贴片多层陶瓷电容（MLCC），标称容值 22 μF，允许偏差 ±20%，额定电压 10 V，介质温度特性为 X6S。该型号常见于 TAIYO YUDEN(太诱) 等厂商的高容值小尺寸电容产品线，适合对体积和电容密度有较高要求的表面贴装应用。
二、主要性能特点
- 小型化封装（0805）实现高容值占位效率，便于高密度 PCB 设计。
- X6S 介质在宽温度范围内有较稳定的电容量表现，适合工业与消费类环境下的去耦与滤波。
- 低等效串联电阻（ESR）与良好频率响应，可提升电源瞬态响应和 EMI 滤波效果。
- 典型误差为 ±20%，满足一般电源旁路与储能需求。
三、注意事项与电性能提示
- 受陶瓷介质特性影响，实际工作电压下（特别是接近额定电压）电容值会有明显的 DC-bias 降低，建议在最终电路中验证有效电容量。
- 温度和频率也会对电容量造成影响，X6S 在极端工况下仍比部分高容率介质稳定，但具体表现应参考厂商数据表。
- 对于需大纹波电流或长期储能的应用，建议与固态电容/钽电容并联使用以补偿 ESR 与容量衰减。
四、典型应用场景
- 移动设备与消费类电子的电源去耦与局部储能。
- DC-DC 转换器输入/输出旁路、低压大电流供电轨的去耦。
- 工业与通信设备的隔离滤波与旁路、电源稳定化。
- LED 驱动与传感器供电滤波等对体积敏感的场景。
五、封装与可靠性建议
- 采用标准回流焊工艺，遵循厂家推荐温度曲线，避免过热或快速冷却引发裂纹。
- 贴装时尽量减少焊盘机械应力与 PCB 弯曲，避免热循环或机械冲击导致微裂纹。
- 开卷后注意防潮保存，必要时按制造商指引进行预烘烤以防焊接缺陷。
总结：LMK212BC6226MG-T 以 0805 小封装实现 22 μF 的高容值，适用于空间受限且需高密度去耦或滤波的电源设计。选型时应关注 DC-bias、温度与频率对容量的影响，并结合实际应用做必要的并联或去耦策略。若需最终电气与封装规范，请参考厂家详细数据手册。
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