Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品简介
UMK212BBJ475KG-T 是一款由太诱(TAIYO YUDEN)生产的表面贴装多层陶瓷电容器(MLCC),其基础参数包括电容量为4.7微法(µF),容差为±10%,额定电压为50伏特(V),以及温度系数为X5R。这款电容器非常适合用于开关电源(SMPS)过滤器等对稳定性和性能有严格要求的电子设备。
基础参数分析
电容量与容差: UMK212BBJ475KG-T 的电容量为4.7µF,能有效满足大多数应用的储能需求。±10%的容差意味着在电容值变化时,可以保证其性能在一定范围内波动,从而满足设计的灵活性。电容量的选择通常依据电路设计的特性及其所需的频率响应。
额定电压: 该电容器的额定电压为50V,适合中等电压的应用场景,这为其在大多数家用电器、电脑硬件及工业设备中的使用提供了良好的安全边际。额定电压选择是设计的关键,过高或过低都会影响电路的整体性能及可靠性。
温度系数与工作温度: X5R类型的温度系数意味着在-55°C 到 85°C 的温度范围内,电容器的电容量相对稳定且变化较小。该电容器能够在不同温度环境下保持稳定的电性能,适合在极端环境中使用,如汽车电子、航空航天及高温工业应用等场景。
安装类型与封装: UMK212BBJ475KG-T 采用0805(2012公制)封装,适合表面贴装(SMD),这种小型化封装不仅节省空间,同时也提供了更好的热管理和电气性能,有助于优化电路板的布局。这种封装类型特别适合于现代电子产品的高密度设计需求。
尺寸与厚度: 此款电容的尺寸为0.079" x 0.049"(2.00mm x 1.25mm),最大厚度为0.057"(1.45mm),较小的体积使其能够在空间受限的电路板上轻松集成,适用于智能设备、便携式电子产品等。
应用场景
UMK212BBJ475KG-T 电容器在多个领域都有广泛的应用:
总结
UMK212BBJ475KG-T 是一款具有优秀电气性能的小型表面贴装电容器,凭借其高容量、高电压和宽广的工作温度范围,能够满足现代电子设备对高性能和稳定性的需求。其在开关电源、消费电子、汽车电子和工业设备中的广泛应用,使其成为设计工程师和制造商的重要选择。选择UMK212BBJ475KG-T,不仅可以提高产品的可靠性,还能优化设计、降低成本,体现出当今电子工程领域对元器件的小型化和高效能的要求。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products