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TAIYO YUDEN HMK107C7224KAHTE
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- TAIYO YUDEN HMK107C7224KAHTE
- Type
- TAIYO YUDEN
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TAIYO YUDEN
- Electronic Component
- HMK107C7224KAHTE
- Electronic Component
- 1
- Electronic Component
- 220nF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.04g
- Electronic Component
- 1
- Electronic Component
- BM0227741707
- Electronic Component
- X7S
- Voltage
- 100V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
HMK107C7224KAHTE 产品概述
一、产品简介
HMK107C7224KAHTE 为 TAIYO YUDEN（太诱）品牌的一款贴片多层陶瓷电容（MLCC），规格为 220nF，公差 ±10%，额定电压 100V，温度特性 X7S，封装 0603。该器件面向通用型电子电路，兼顾体积小、高电压耐受与良好电气性能，适合对空间和电压要求同时较高的应用场景。
二、主要参数与特性
- 容值：220 nF（0.22 µF），常用于旁路、耦合与滤波。
- 精度：±10%，适合对容值精度要求一般的场合。
- 额定电压：100 V，适合中高压电源滤波、DC-DC 等电路的去耦与能量缓冲。
- 温度特性：X7S，工作温度范围覆盖宽温域，属于通用型温度特性，兼顾容量稳定性与温度适应性。
- 封装：0603（1608公制），占板面积小，有利于高密度贴装。
- MLCC 优势：体积小、等效串联电阻（ESR）和等效串联电感（ESL）低，适合高速去耦与高频滤波需求。
三、典型应用场景
- 开关电源和DC-DC模块的输入/输出滤波和旁路。
- 模拟电路的耦合与退耦（需考虑电压与容值稳定性）。
- 工业与消费类产品中对中高电压去耦的空间受限场合。
- 高频去耦与EMI 滤波（结合其他元件组成π型或LC滤波）。
四、封装与装配建议
- 0603 小封装利于高密度布板，但须注意焊盘设计与回流温度曲线，按主流无铅回流规范进行回流焊接。
- 贴装时避免在元件上施加机械应力（如强力刮擦、板弯曲），以防裂纹导致性能下降或失效。
- 对焊接参数建议参照供应商的回流曲线与焊膏建议，以保证焊接可靠性与电气性能。
五、可靠性与注意事项
- 虽为高压等级元件，但 MLCC 在受到机械冲击或基板弯曲时可能出现裂纹，设计时应考虑板材厚度与固定方式。
- X7S 为通用温度特性，容量随温度与电压可能出现一定偏移，关键电路中建议进行实测验证。
- 如需汽车级或特殊认证（如 AEC 等），请向供应商确认具体型号与认证状态。
六、总结
HMK107C7224KAHTE 是一款针对空间受限且需承受较高工作电压的通用型 MLCC，220nF/100V 的组合在电源滤波与去耦应用中具有良好实用性。设计时应兼顾封装机械强度与温度/电压下的容量变化，按供应商推荐的装配工艺操作可获得稳定的长期性能。如需更详细的电气特性曲线、耐久性数据或样片支持，建议联系 TAIYO YUDEN 获取器件数据手册与测试报告。
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