WMSIC Electronic Components

TAIYO YUDEN MSASU21GBB5475KTNA01

ModelMSASU21GBB5475KTNA01
Package0805
BrandTAIYO YUDEN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
TAIYO YUDEN MSASU21GBB5475KTNA01
Type
TAIYO YUDEN
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TAIYO YUDEN
Electronic Component
MSASU21GBB5475KTNA01
Electronic Component
1
Electronic Component
4.7uF
Package
0805
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.04g
Electronic Component
1
Electronic Component
BM0264685596
Electronic Component
X5R
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MSASU21GBB5475KTNA01 产品概述

一、概述

MSASU21GBB5475KTNA01 是 TAIYO YUDEN(太诱)的一款贴片多层陶瓷电容,标称容量 4.7μF,公差 ±10%,额定电压 50V,介质类型 X5R,封装 0805(2012 英制),适用于表面贴装工艺的卷带(T/R)供货。X5R 介质允许在 -55°C 至 +85°C 温度范围内容量变化在规定范围内,整体尺寸小、容量密度高,适合对体积与性能有中等要求的电路设计。

二、主要规格

  • 容量:4.7 μF ±10%(标称)
  • 额定电压:50 V DC
  • 温度特性:X5R(-55°C ~ +85°C,容量允许漂移)
  • 封装:0805(2012 公制)SMD
  • 包装:卷带(T/R),适配自动贴片机

三、关键特性与优势

  • 体积小、容量密度高,适合空间受限的应用。
  • X5R 平衡了温度稳定性与高容量的需求,较适合旁路、去耦和一般滤波场合。
  • 高额定电压(50V)在直流偏置下比低压器件有更好的保留容量表现,适合有中等偏置条件的电源设计。
  • 卷带包装便于高速贴片生产,提高产线效率。

四、典型应用

  • 电源去耦与旁路(中小功率 DC-DC 输出滤波)
  • 模拟电路旁路/耦合、耦合电容(需注意偏置与温度影响)
  • 工业与消费类电子的滤波与稳定电源设计

五、设计与使用注意事项

  • MLCC 在有直流偏置时会出现容量下降,具体下降量与实际电压有关,设计时应参考厂方直流偏置特性曲线并适当留裕。
  • X5R 容性随温度变化,若对容量稳定性要求严格(如高精度滤波/计量),建议选用温度系数更稳定的介质或增加裕量。
  • 焊接时遵循厂方推荐的回流温度曲线(通用建议峰值≤260°C 并参考 J-STD-020),避免机械应力与过热导致裂纹。
  • 贴片与 PCB 焊盘设计需考虑应力分散,避免贴片附近产生弯曲或热循环应力。

六、包装、储存与可靠性

  • 采用卷带包装,适配自动贴片;订购时请确认每卷数量与箱标信息。
  • 建议在干燥环境中储存,避免长期潮湿暴露;回流前如超期需进行烘烤处理以防焊接缺陷。
  • 常规 MLCC 可靠性高,但对机械冲击和弯曲敏感,生产与装配阶段应注意搬运与夹具设计。

七、选型与替代建议

  • 若需更高温度范围或更好容量稳定性,可考虑 X7R/NP0/C0G 等不同介质与公差组合。
  • 对直流偏置敏感场合可优先选择额定电压更高或体积更大的同容量器件以减轻偏置效应。
  • 具体电气参数(如 ESR、ESL、直流偏置曲线、封装引脚图)请以 Taiyo Yuden 官方数据表为准,选型时建议参考原厂完整资料并进行实测验证。

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