WMSIC Electronic Components

TAIYO YUDEN EMK212BB7106MG-T EMK212BB7106MG

ModelEMK212BB7106MG-T
Package0805
BrandTAIYO YUDEN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
TAIYO YUDEN EMK212BB7106MG-T
Type
TAIYO YUDEN
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TAIYO YUDEN
Electronic Component
EMK212BB7106MG-T
Electronic Component
1
Electronic Component
10uF
Package
0805
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±20%
Electronic Component
0.04g
Electronic Component
1
Electronic Component
BM0000003735
Electronic Component
X7R
Voltage
16V
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

EMK212BB7106MG-T 产品概述

概述

EMK212BB7106MG-T 是一款高性能的多层陶瓷电容(MLCC),由著名电子元器件制造商太诱(TAIYO YUDEN)生产。该电容器具有 10µF 的电容值,允许的容差为 ±20%,额定电压为 16V,非常适合在各种电子应用中使用,特别是在开关电源(SMPS)过滤器中,能够有效平滑输入和输出电流波动,提升电源的稳定性和效率。

关键特性

  1. 电容值与容差: 本产品的电容值为 10µF,容差为 ±20%,使其在诸多应用场景中具备良好的灵活性和适用性。电容的容差对于设计电路时,特别是在滤波和耦合应用中,能够满足不同电路设计的需求。

  2. 额定电压: 该电容器的额定电压为 16V,确保其在电压波动或突发电压情况下的可靠性,适用于12V及更低电压的电路。

  3. 温度特性: EMK212BB7106MG-T 使用的是 X7R 温度特性,这意味着它在-55°C至125°C的工作温度范围内保持较好的电容稳定性。X7R类型的电容器在环境温度变化时,电容值变化较小,适合用于温度波动较大的应用场合。

  4. 封装与尺寸: 此款电容器采用0805封装(2012公制),尺寸为2.00mm × 1.25mm,最大厚度为1.35mm,使其适合表面贴装(SMD)设计,便于在现代小型化电子设备中进行布局和安装。

  5. 工作环境: 通过广泛的工作温度范围和高额定电压,表明该电容器具有良好的环境适应性,可以在家庭电器、工业设备、便携电子产品以及其他各种电气设备中稳定工作。

应用场景

EMK212BB7106MG-T 主要用于开关电源(SMPS)滤波器中。在这些电源电路中,电容器起到了重要的调节和过滤作用,通过抑制高频噪声和提供平滑直流电压,来保障其他电子元件的正常运行。此外,其小巧的0805封装使其非常适合用于空间受限的电路板设计,这对于智能手机、平板电脑、家用电器等现代消费电子产品尤为重要。

性能优势

  • 高可靠性:太诱(TAIYO YUDEN)作为全球领先的电子元件制造商,其产品以高质量和稳定的性能著称,EMK212BB7106MG-T也承袭了这一优点,在长期使用中表现出色。
  • 适合高频应用:MLCC 类型的电容器具有良好的高频特性和反应速度,能够在高频信号处理应用中有效地降低信号噪声。
  • 小型化设计:0805 封装的设计使得该电容可以在微型化设备中使用,有助于缩小整体设备体积,并提高设备的集成度。

总结

EMK212BB7106MG-T 是一款集高性能、高可靠性与出色集成度于一身的多层陶瓷电容器,适用于多种电子应用,特别是在需要稳定滤波效果的电源管理电路中。其多样的特性使得其在市场上具备了极强的竞争力,是研发人员和设计者在选择陶瓷电容器时的理想选择。在设计高效、可靠的电子产品时,EMK212BB7106MG-T 无疑是一个卓越的元器件选项。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.