Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
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TMK212B7225KG-TR 是由太诱(TAIYO YUDEN)生产的多层陶瓷电容器(MLCC),适用于各种电子设备中的高频滤波和耦合应用。以下是对此产品的详细介绍。
TMK212B7225KG-TR 主要用于开关模式电源(SMPS)中的过滤器应用。其高频性能和稳定的温度特性使其非常适合用于高效能和高可靠性的电源系统。
TMK212B7225KG-TR 由日本知名电子元器件制造商太诱(TAIYO YUDEN)生产。太诱以其高质量和可靠性的产品而闻名,广泛应用于各个行业。
该电容器具有2.2 µF的电容值,容差为±10%。这种容差水平保证了在实际应用中电容器的性能稳定性和可靠性。
TMK212B7225KG-TR 的额定电压为25 V,这使得它能够在各种中低压电路中使用,包括但不限于开关模式电源、滤波电路和耦合电路。
X7R 是一种常见的温度系数分类,表示在-55°C ~ 125°C 的温度范围内,电容值变化不会超过±15%。这种特性确保了在广泛的温度条件下,电容器仍能保持稳定的性能。
该电容器的工作温度范围从-55°C 到 125°C,这使得它能够适应各种极端环境下的应用需求。这种广泛的温度适应性使其成为许多工业和汽车电子系统中的理想选择。
在SMPS系统中,TMK212B7225KG-TR 可以作为输入或输出滤波器,帮助减少电磁干扰(EMI)和电源噪声。其高频性能和低等效串联电阻(ESR)确保了高效能的能量传输和稳定的输出。
除了过滤应用外,TMK212B7225KG-TR 也可以用于信号耦合和分压电路。其稳定的电容值和低失真特性使得它非常适合用于高频信号处理。
TMK212B7225KG-TR 采用表面贴装技术,这简化了生产过程并提高了生产效率。其小尺寸设计使得它可以在紧凑的 PCB 布局中使用。
0805 封装尺寸(2.00 mm x 1.25 mm)使得该电容器非常适合于现代电子设备中的空间有限的设计。最大厚度为1.35 mm,也有助于减少整体产品的厚度。
太诱(TAIYO YUDEN)是一家具有丰富经验和技术优势的电子元器件制造商。他们的产品以高质量、可靠性和创新性而闻名。选择太诱的产品,可以确保您获得优质的电子元器件,满足您对性能、稳定性和可靠性的要求。
TMK212B7225KG-TR 是一款高性能、多功能的多层陶瓷电容器,特别适用于开关模式电源中的过滤应用以及其他需要稳定高频性能的场景。其优异的温度特性、紧凑的封装尺寸和可靠的品牌背书,使其成为现代电子设计中的理想选择。无论是在工业自动化、汽车电子还是消费电子领域,这款电容器都能提供卓越的性能和可靠性。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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