WMSIC Electronic Components

TAIYO YUDEN NRS3015T150MNGH

ModelNRS3015T150MNGH
PackageSMD,3x3mm
BrandTAIYO YUDEN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TAIYO YUDEN NRS3015T150MNGH
Type
TAIYO YUDEN
Unit
Electronic Component
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TAIYO YUDEN
Electronic Component
NRS3015T150MNGH
Electronic Component
1
Package
SMD,3x3mm
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
0.212g
Inductor
15uH
Electronic Component
1
Electronic Component
BM0263672936
Current
580mA
Resistor(DCR)
325mΩ
Electronic Component
Electronic Component
Electronic Component
2000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

NRS3015T150MNGH 产品概述

一、产品简介

NRS3015T150MNGH 是 TAIYO YUDEN(太诱)推出的一款功率贴片电感,封装尺寸 3.0 × 3.0 mm,标称电感量 15 μH,公差 ±20%。该器件面向需要小尺寸、高可靠性的开关电源滤波与能量存储场合,适用于移动电源、便携式设备与各类 DC–DC 转换模块。

二、主要技术参数

  • 电感值:15 μH(±20%)
  • 额定电流:580 mA
  • 饱和电流(Isat):580 mA(标称)
  • 直流电阻(DCR):325 mΩ
  • 封装:SMD,3×3 mm
  • 品牌:TAIYO YUDEN

三、特性与优势

  • 小型化:3×3 mm 体积便于高密度 PCB 布局,适合空间受限的应用。
  • 功率级别:580 mA 的额定/饱和电流可满足中低功率 DC–DC 环路的储能与滤波需求。
  • 性能稳定:制造工艺与材料选择保证在常温下良好的电感稳定性与可重复性。
  • 可贴片化生产:SMD 形式兼容自动化贴装与回流焊工艺,便于量产。

四、性能解读与工程考虑

  • 饱和电流与额定电流相同:当通过电流接近 580 mA 时,电感量会开始明显下降,设计时应留有裕量以避免环路性能退化。通常在纹波电流或峰值电流较大时,建议采用 60%–80% 的电流留余(视系统容忍度而定)。
  • DCR 带来的功耗:在 580 mA 恒流下,约产生 P = I^2·R ≈ 0.58^2×0.325 ≈ 0.11 W 的直流损耗,设计时需考虑局部升温与热散布。
  • 电感公差 ±20%:用于滤波时需考虑容差对截止频率与环路稳定性的影响,必要时在仿真中使用最差容差进行验证。

五、应用场景与布局建议

  • 典型应用:降压/升压 DC–DC 输出滤波、输入 EMI 滤波、能量存储元件、低速电源模块。
  • PCB 布局:电感两端短且宽的回流路径,可减小寄生电阻与 EMI;紧邻开关元件(MOSFET、二极管)与电容合理布局以降低环路面积。
  • 焊接与可靠性:兼容常规无铅回流工艺,建议遵循厂商的回流温度曲线与预热/冷却规范,避免长时间高温暴露。

六、可靠性与使用注意

  • 在高温、高湿或强振动环境下,应做可靠性验证(温循环、振动、潮湿试验等)。
  • 对于有较大瞬态浪涌或脉冲电流的场合,需评估脉冲饱和行为并考虑更高额定电流的器件或并联方案。
  • 储存与搬运按普通电子元件规范进行,避免机械冲击导致结构损伤。

七、选型与替代建议

  • 若需更高电流或更低 DCR,可选择同系列或其它厂商的更大尺寸/功率级电感;若对电感精度要求更高,可考虑公差更小的型号。
  • 订购时请确认完整料号与包装形式(卷带/盘装)以符合 SMT 生产需求。

总结:NRS3015T150MNGH 在 3×3 mm 小型封装下提供 15 μH 的电感值与 580 mA 的功率能力,适合中低功率滤波与能量存储场合。设计时关注电流裕量、损耗与温升,以及电感容差对系统性能的影响,可确保稳定可靠的应用效果。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.