Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
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EMK316BJ226ML-T 是一款高性能的多层陶瓷电容器(MLCC,Multi-Layer Ceramic Capacitor),由知名电子元器件制造商TAIYO YUDEN(太诱)提供。其设计目标是满足现代电子设备在功率管理和滤波应用中的严苛要求,尤其是开关电源(SMPS)等高频电路中。下面将详细介绍该电容器的关键参数、应用场景和优势。
电容值及容差: EMK316BJ226ML-T 的电容值为 22µF,适用于各种滤波和耦合应用。±20%的容差确保了在不同温度和电压条件下,电容器的稳定性。
额定电压: 该电容器的额定电压为 16V,能够有效抑制由于电压波动引起的损耗,适用于大部分低到中等电压的应用场景。
温度系数: 采用 X5R 温度系数,表示在 -55°C 到 85°C 的温度范围内,该电容的电容值变化小于±15%,这使其在温度波动较大的环境中仍然能够保持相对稳定的性能。
尺寸与封装: 封装尺寸为 1206(3.20mm x 1.60mm),适合表面贴装。小型化设计使得该电容器非常适合高密度电路板的使用,尤其是在空间有限的便携式设备中。
厚度: 最大厚度为 1.80mm,符合现代电子产品对薄型化的要求,使得在设计时能够更加灵活地安排元器件布局。
EMK316BJ226ML-T 适用于众多场景,特别是在现代电子设备中非常常见的应用包括:
EMK316BJ226ML-T 是一款适应性强、性能优良的多层陶瓷电容器,适合在高性能电子系统中广泛使用。无论是在开关电源、噪声过滤还是耦合解耦应用中,该电容器都能发挥出色的效果,帮助设计师提升电路性能和稳定性。选择 EMK316BJ226ML-T,代表着选择了一款可靠的电子元器件,为您的产品保驾护航。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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