Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TAIYO YUDEN EMK316AB7106KLHT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- TAIYO YUDEN EMK316AB7106KLHT
- Type
- TAIYO YUDEN
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TAIYO YUDEN
- Electronic Component
- EMK316AB7106KLHT
- Electronic Component
- 1
- Electronic Component
- 10uF
- Package
- 1206
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.078g
- Electronic Component
- 1
- Electronic Component
- BM0084329274
- Electronic Component
- X7R
- Voltage
- 16V
- Electronic Component
- Electronic Component
- Electronic Component
- 2000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：EMK316AB7106KLHT
一、产品基本信息
EMK316AB7106KLHT是由日本著名电子元器件制造商Taiyo Yuden（太诱）生产的一款多层陶瓷电容器（MLCC）。该产品属于M系列，具有出色的可靠性和稳定性，专门设计用于高要求的汽车电子应用。
二、主要参数
- 电压额定值：16V
- 电容值：10µF
- 容差：±10%
- 温度系数：X7R，适用于高温性能需求
- 工作温度范围：-55°C至125°C，保证在极端环境下的稳定工作
- 规格等级：AEC-Q200，符合汽车行业标准，保证可靠性
- 安装方式：表面贴装，便于自动化生产和高密度组装
- 封装尺寸：1206（3216公制），适合多种PCB设计
- 厚度：最大0.071英寸（1.80 mm）
三、应用场景
EMK316AB7106KLHT主要应用于汽车行业，特别适合于新能源汽车、汽车电子控制单元（ECU）、车载信息娱乐系统及其他重要电子组件。这种电容器在电源旁路、滤波和耦合等电路中非常有效，能够降低电波干扰并提高电路的整体性能。
四、产品特点
- 高温稳定性：X7R温度系数使得该电容器能够在宽广的温度范围内保持较为恒定的电容值，适合于高温环境下的应用。
- 紧凑尺寸：1206封装使其在电路板中占用较少空间，有助于实现更高的设备集成度。
- 优越的电气性能：该电容器不仅具备良好的电压和温度性能，且其低ESR（等效串联电阻）特性使其能够处理快速变化的电流，提升滤波效果。
- 优质材料和生产工艺：Taiyo Yuden在电子元器件制造方面经验丰富，使用高质量原材料和先进生产工艺，确保产品的稳定性和可靠性。
五、市场优势
随着汽车行业向智能化和电动化发展，对电子元器件的需求日益增加，EMK316AB7106KLHT凭借其卓越的性能和高可靠性，能够满足汽车行业对品质的严格要求。此外，其AEC-Q200认证使其在汽车市场上具有更强的竞争优势，成为设计工程师和制造商的理想选择。
六、结论
EMK316AB7106KLHT多层陶瓷电容器是结合了高性能与优质制造标准的顶尖电子元器件。它适用于各种汽车电子应用，能够在极端的工作环境下提供卓越的电性能，是现代汽车电子设备中不可或缺的重要组成部分。选择EMK316AB7106KLHT，意味着选择了高质量、高可靠性的电子元器件，为客户提供了更具竞争力的技术解决方案。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
