Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TAIYO YUDEN HMK316B7105KL-T HMK316B7105KL
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- TAIYO YUDEN HMK316B7105KL-T
- Type
- TAIYO YUDEN
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TAIYO YUDEN
- Electronic Component
- HMK316B7105KL-T
- Electronic Component
- 1
- Electronic Component
- 1uF
- Package
- 1206
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.071g
- Electronic Component
- 1
- Electronic Component
- BM0000002177
- Electronic Component
- X7R
- Voltage
- 100V
- Electronic Component
- Electronic Component
- Electronic Component
- 2000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
HMK316B7105KL-T 产品概述
概述
HMK316B7105KL-T是一种高性能的多层陶瓷电容器（MLCC），由日本著名电子元器件制造商太诱（TAIYO YUDEN）生产。这款电容器的设计旨在满足现代电子设备对小型化、高性能和稳定性的需求，广泛应用于开关电源（SMPS）过滤器等电子电路中。它的结构、材质和技术规格使其在各类应用场景中表现出色，并且具有较宽的工作温度范围和良好的电气特性。
产品特点
额定电压和电容量
HMK316B7105KL-T的额定电压为100V，电容值为1µF，说明它可以在高压环境中工作且具有一定的储能能力。这使得它非常适合用作电源滤波及去耦电容，帮助提升电路的稳定性和效率。温度特性
该电容采用X7R温度系数，温度范围为-55°C到125°C。这意味着在极端温度下，电容能够保持相对稳定的电容量，适合用于多种工业和消费电子产品，如汽车电子、通信设备和家用电器。封装和尺寸
HMK316B7105KL-T采用表面贴装（SMD）形式，封装尺寸为1206（3.20mm x 1.60mm），厚度最大为0.071"（1.80mm）。这种小型化设计使其非常适合于空间有限的电子电路板，便于实现更高的集成度和轻薄化设计。容差
该电容的容差为±10%，确保在制造过程中所产生的电容值波动在可接受的范围内，满足多种应用需求。但对于一些精密应用，使用者在选择电容时应考虑这一因素。应用领域
HMK316B7105KL-T特别适用于开关电源的滤波应用，可以有效减少电源电路中的纹波和噪声，提高电源的稳定性。其他应用领域包括移动设备、汽车电子、计算机及相关外围设备，乃至于工业控制系统。
应用实例
在现代电子环境中，HMK316B7105KL-T的特性使其成为开关电源（SMPS）设计中不可或缺的元件。它能够在高频条件下工作，满足大多数电源设计对电容的需求。此外，由于其良好的温度稳定性，适合用于医疗设备、航空航天和军事领域等对可靠性要求极高的场合。
结束语
总体来说，HMK316B7105KL-T是一款性能优越、尺寸小巧的高电压MLCC电容器。凭借其卓越的电气性能和温度特性，广泛适用于多种电子应用。在众多电子元器件中，该产品以其高可靠性和适用性成为设计师的首选之一，无疑是现代电子设计中不可或缺的重要元件。选择HMK316B7105KL-T，将为您的电子项目提供强而有力的技术支持和稳健的性能保障。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
