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TAIYO YUDEN HMK212BC7105KG-TE HMK212BC7105KG
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- TAIYO YUDEN HMK212BC7105KG-TE
- Type
- TAIYO YUDEN
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TAIYO YUDEN
- Electronic Component
- HMK212BC7105KG-TE
- Electronic Component
- 1
- Electronic Component
- 1uF
- Package
- 0805
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.041g
- Electronic Component
- 1
- Electronic Component
- BM0231139269
- Electronic Component
- X7S
- Voltage
- 100V
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
HMK212BC7105KG-TE 产品概述
一、概述
HMK212BC7105KG-TE 为 TAIYO YUDEN（太阳诱电）系列贴片多层陶瓷电容（MLCC），额定电容 1 μF，公差 ±10%，额定电压 100 V，介质特性为 X7S，封装为 0805（约 2.0 × 1.25 mm）。该型号针对需要中等电容量与较高耐压的表面贴装电路设计，适合在受限空间内实现高电压旁路、滤波与耦合功能。
二、主要参数
- 容值：1 μF
- 精度：±10%
- 额定电压：100 V
- 温度系数/介质：X7S（适用于宽温度范围的通用型介质）
- 封装：0805（约 2.0 × 1.25 mm）
- 封装形式：贴片（MLCC）
三、特点与优势
- 高耐压：100 V 额定电压适用于较高电压的滤波与直流隔离场合。
- 中等容量密度：1 μF 在 0805 封装中提供良好的容量/占板面积比，适合空间受限的设计。
- 通用温度特性：X7S 介质在较宽温度范围内维持较稳定的电容量，适用于一般工业与消费类环境。
- SMT 兼容：0805 封装便于自动化贴装与回流焊处理，良好的可制造性与一致性。
四、典型应用
- 电源滤波与去耦（DC-DC 转换器输入/输出端）
- 模拟信号耦合与去耦
- 高压采样与测量电路中的隔离/旁路元件
- LED 驱动与电机控制等需要中等容量且耐压较高的场合
五、使用与注意事项
- X7S 为陶瓷介质，工作时存在直流偏压导致的电容量下降（DC bias effect），在高偏压条件下请参考厂商的 DC bias 特性曲线以确认实际容量满足电路需求。
- MLCC 对机械应力、弯曲与热冲击敏感，贴装时避免过度挤压或在刚性基板边缘处产生机械应力。
- 若用于关键可靠性场合（汽车、医疗等），请确认器件是否具备相应的认证或额外筛选要求。
六、封装与装配建议
- 0805（2012 系列）适配常见 PCB 阵列与焊盘尺寸，建议参考 TAIYO YUDEN 官方推荐的焊盘布局以获得最佳焊点可靠性。
- 采用无铅回流焊时请遵循厂商给出的温度曲线，避免超过推荐的峰值温度与时长。
- 储存与输运应避免潮湿与高温，开盘后按 SMT 料带/盘规定尽快使用。
综合来看，HMK212BC7105KG-TE 在 0805 小封装中实现了 1 μF/100 V 的配置，是需要在受限尺寸内实现较高耐压旁路与滤波的理想选择。选用时请结合电路的 DC 偏压、温度范围与可靠性要求，参照完整数据表进行最终验证。
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