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TAIYO YUDEN TMK325B7226KMHP
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- TAIYO YUDEN TMK325B7226KMHP
- Type
- TAIYO YUDEN
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TAIYO YUDEN
- Electronic Component
- TMK325B7226KMHP
- Electronic Component
- 1
- Electronic Component
- 22uF
- Package
- 1210
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.165g
- Electronic Component
- 1
- Electronic Component
- BM0000002929
- Electronic Component
- X7R
- Voltage
- 25V
- Electronic Component
- Electronic Component
- Electronic Component
- 1000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TMK325B7226KMHP 产品概述
产品概述
TMK325B7226KMHP是由知名电子元器件制造商太诱（TAIYO YUDEN）出品的一款高性能多层陶瓷电容器（MLCC），广泛应用于汽车电子领域。作为符合AEC-Q200标准的汽车级元器件，TMK325B7226KMHP保证了在极端环境条件下的稳定性和可靠性。其核心性能包括22μF的电容量、25V的额定电压以及±10%的容差，使其在各类应用中具备优秀的表现。
基本参数
- 电容值：22µF
- 电压额定值：最大25V
- 容差：±10%
- 温度系数：X7R
- 工作温度范围：-55°C ~ 125°C
- 封装形式：1210（3225公制），表面贴装（SMD）
TMK325B7226KMHP采用了先进的X7R温度特性，这意味着它可以在宽广的温度范围内保持相对稳定的电容值。具体来说，X7R电容器在-55°C到+125°C的环境温度下，其电量变化不超过±15%。这一特性使其非常适合用于对温度敏感的应用场合，如汽车电子系统、工业控制器和消费电子产品等。
尺寸与封装
TMK325B7226KMHP的封装类型为表面贴装MLCC，尺寸为1210（3.20mm x 2.50mm，最大厚度为2.70mm）。该尺寸设计不仅满足紧凑型电路的需求，还极大地提升了元器件的安装效率。随着电子设备的日益小型化，使用如此小巧的电容器能够有效节省电路板的空间，为设计师提供了更大的灵活性。
应用领域
由于符合AEC-Q200标准，TMK325B7226KMHP特别适合汽车级应用，包括但不限于：
- 汽车音响系统
- 电池管理系统
- 电动汽车的动力控制单元
- 传感器及其信号处理电路
- 汽车照明控制电路
此外，该电容器也适用于其他工业及消费电子应用，如智能家居设备、医疗器械和通信设备等。
性能优势
高可靠性：作为汽车级组件，TMK325B7226KMHP在生产过程中经过严格的质量控制，能够承受多种机械和热应力，确保长期稳定运行。
高温度稳定性：X7R温度系数保证在宽温范围内电容的稳定性，使其适合各种气候和复杂的工作环境。
高容值小体积：22µF的高电容值与其小巧的物理尺寸相结合，具备了良好的性能与小型化的设计，适合高密度PCB布局。
表面贴装便捷性：SMD封装形式简化了生产过程中的自动化装配，提高了制造效率，降低了生产成本。
综上所述，TMK325B7226KMHP是一款性能卓越、可靠性高的MLCC，适合多种高要求的应用场景，尤其是汽车电子领域。凭借其优越的电容特性和长期的稳定性，TMK325B7226KMHP无疑是用户在选择电容器时的一个理想选择。
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