WMSIC Electronic Components

TAIYO YUDEN NRS4018T150MDGJ

ModelNRS4018T150MDGJ
PackageSMD,4x4mm
BrandTAIYO YUDEN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TAIYO YUDEN NRS4018T150MDGJ
Type
TAIYO YUDEN
Minimum package
3500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TAIYO YUDEN
Electronic Component
NRS4018T150MDGJ
Electronic Component
1
Package
SMD,4x4mm
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
0.19g
Inductor
15uH
Electronic Component
1
Electronic Component
BM0266014808
Current
850mA
Resistor(DCR)
252mΩ
Electronic Component
Electronic Component
Electronic Component
3500
and Current(Isat)
1.1A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

NRS4018T150MDGJ功率电感产品概述

一、产品定位与典型应用场景

NRS4018T150MDGJ是TAIYO YUDEN(太诱)推出的小型化贴片功率电感,核心面向对体积、效率有严格要求的中低功率电子场景,典型应用包括:

  • 智能手机、智能手表等手持设备的电源管理单元(PMU)滤波;
  • 物联网(IoT)终端的低功耗DC-DC降压/升压电路;
  • 小型家电(如蓝牙耳机、智能音箱)的电源模块;
  • 车载辅助电子(如行车记录仪、氛围灯驱动)的低压电源转换。

其4×4mm紧凑封装,适配高密度PCB布局,能有效缩小产品体积,符合消费电子“轻薄化”趋势。

二、核心电气性能参数解析

1. 电感值与精度

标称电感值15μH,精度±20%,覆盖多数1-5W电源电路的滤波、储能需求,无需额外匹配元件,简化设计流程。

2. 电流承载能力

  • 额定电流(Irms):850mA:指持续工作时,电感温升不超过行业标准(≤40℃)的最大电流,是日常选型的核心参考(避免长期过热损坏);
  • 饱和电流(Isat):1.1A:指磁芯未发生明显磁饱和(电感值下降≤30%)的最大电流,为突发负载波动(如设备启动瞬间)提供安全冗余,保障电路稳定性。

3. 直流电阻(DCR):252mΩ

低DCR可显著降低电流传导损耗,减少电感自身发热——在低电压大电流场景(如3.3V/0.8A输出)下,能提升电源转换效率约1-2%,延长电池续航(针对便携式设备)。

三、物理特性与封装优势

1. 封装规格

采用SMD贴片封装,尺寸为4×4×1.8mm(行业命名“4018”),属于小型化功率电感范畴,适配0402、0603等常规贴片元件的PCB布局,可与其他被动元件紧凑排列。

2. 磁芯与引脚

  • 磁芯:太诱特有的软磁合金材料(推测为铁氧体复合磁芯),兼具高磁导率与低高频损耗,在100kHz-1MHz开关频率范围内性能稳定;
  • 引脚:标准镀锡/镀镍工艺,兼容回流焊、波峰焊,焊接可靠性符合IPC-A-610标准,避免虚焊、脱焊问题。

四、可靠性与环境适应性

1. 温度范围

工作温度覆盖**-40℃至+125℃**,满足工业级(如户外IoT终端)、消费级(如车载低温环境)的温度要求,无需额外散热设计。

2. 抗振动/冲击

通过振动测试(10-2000Hz,1.5G)与冲击测试(1000G,0.1ms),适配移动设备(如手持终端)或车载等振动场景,不易因机械应力失效。

3. 耐腐蚀性

表面采用防氧化涂层,引脚镀锡层厚度符合标准,可抵抗常规环境下的湿度(≤95%RH)、盐雾腐蚀,延长产品使用寿命(MTBF可达10万小时以上)。

五、选型与应用注意事项

  1. 电流匹配:实际工作电流需≤850mA,突发峰值电流≤1.1A(避免磁饱和导致电感值骤降,影响电路输出);
  2. 频率适配:最佳工作频率为100kHz-1MHz,若应用于2MHz以上高频场景,需注意磁芯损耗增加(可通过降额使用缓解);
  3. PCB布局:电感需靠近电源输出端,减少走线寄生电感;避免与高频信号线平行布线(降低EMI干扰);
  4. 焊接工艺:回流焊峰值温度控制在230-250℃,时间≤10秒(过热会损坏磁芯);波峰焊需使用专用夹具固定,避免引脚变形。

总结

NRS4018T150MDGJ是一款**“小体积、高效率、高可靠”**的贴片功率电感,通过紧凑封装、合理电流冗余与低损耗设计,完美适配便携式设备、小型电源模块等场景。其稳定的性能与环境适应性,可帮助工程师简化电路设计,提升产品竞争力,是中低功率电源设计的优选元件之一。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.