Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TAIYO YUDEN TMK316AB7106KLHT
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TAIYO YUDEN TMK316AB7106KLHT
- Type
- TAIYO YUDEN
- Unit
- Electronic Component
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TAIYO YUDEN
- Electronic Component
- TMK316AB7106KLHT
- Electronic Component
- 1
- Electronic Component
- 10uF
- Package
- 1206
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.078g
- Electronic Component
- 1
- Electronic Component
- BM0000000678
- Electronic Component
- X7R
- Voltage
- 25V
- Electronic Component
- Electronic Component
- Electronic Component
- 2000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TMK316AB7106KLHT 产品概述
产品概述
TMK316AB7106KLHT是一款符合汽车级标准的表面贴装陶瓷电容器，隶属于著名电子元器件制造商太诱（TAIYO YUDEN）。该电容器具备较高的电压额定、良好的温度特性以及符合AEC-Q200认证，特别适合用于汽车和工业环境中，能够可靠地应对严苛的工作条件。
主要参数
- 电容值：10µF
- 电压额定：25V
- 容差：±10%
- 温度系数：X7R
- 工作温度范围：-55°C至125°C
- 封装类型：1206（3216公制）
- 尺寸：0.126英寸长（3.20mm） x 0.063英寸宽（1.60mm）
- 最大厚度：0.071英寸（1.80mm）
应用领域
TMK316AB7106KLHT的应用范围极广，适用于：
- 汽车电子（如车载音响、导航系统、车身控制模块等）
- 工业设备（如自动化控制系统、机械控制装置等）
- 消费电子（如智能手机、平板电脑及其他移动设备）
- 计算机及通信设备
由于其高温和宽温度范围的特性，该电容器能够在各种极端环境下稳定工作，确保电路的可靠性和性能。
设计与特点
TMK316AB7106KLHT采用了现代的表面贴装技术（SMD），使得其在空间受限的电路板设计中得以高效利用。1206封装提供了出色的功率密度和电气性能，使其不仅在电路的小型化设计中脱颖而出，同时也显著提高了其热管理能力。
电容器采用X7R温度系数材料，能够在-55°C至125°C的广泛温度范围内保持电容的稳定性。这使得TMK316AB7106KLHT在应用中能够有效抵御温度波动带来的影响，从而确保长时间的可靠运行。此外，±10%的容差范围使得此款电容器在电气设计中能广泛适应不同电路的需求。
可靠性与认证
作为一款符合AEC-Q200标准的产品，TMK316AB7106KLHT体现了太诱在品质控制和可靠性方面的努力。AEC-Q200认证针对汽车行业的特殊要求，确保该电容器在长期使用中保持稳定的性能，抵御振动和温度变化造成的损坏。
总结
TMK316AB7106KLHT是一款高性能的汽车级表面贴装陶瓷电容器，具备10µF的电容值和25V的电压额定，广泛应用于汽车、工业和消费电子等领域。其出色的温度范围、良好的容差和稳定的电性能使其成为严苛环境下的理想选择。通过现代的设计和制造工艺，该电容器不仅提高了空间利用率，同时确保了双方安全和长期可靠性，是广大设计工程师的优质选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
