Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
JMK325BJ107MM-T 是一款由太诱(TAIYO YUDEN)公司生产的表面贴装多层陶瓷电容器(MLCC),其电压额定值为6.3V,电容值为100µF,具有±20%的容差和 X5R 温度系数。该电容器采用1210封装,尺寸为0.126英寸长 x 0.098英寸宽(约3.20mm x 2.50mm),厚度最大值为0.106英寸(2.70mm)。此元器件特别适用于开关电源(SMPS)过滤器等应用场合,在电子设备中发挥着重要的电源管理和滤波作用。
JMK325BJ107MM-T 主要用于需要高稳定性和小型化的电路。其适用领域包括:
厚度和尺寸: JMK325BJ107MM-T的紧凑型1210封装,使其适合现代小型化电子产品的设计需求。尽管占用空间小,但它仍能提供足够的电容值和电流承载能力,满足各种应用的要求。
容差和额定电压:±20%的容差为设计师提供了灵活性,使其能够适应不同的应用需求。6.3V的额定电压确保其适用于大部分低电压电源电路。
温度系数X5R: X5R是一种非常常见的温度系数类型,其工作温度范围为-55°C到85°C,适合多种环境条件。其电容值在此温度范围内相对稳定,适合温度变化较大的应用。
电源管理: 在电源管理系统中,JMK325BJ107MM-T电容器可用于构建有效的去耦电路,以降低电源噪声,同时提高系统的抗干扰能力。
作为一种表面贴装电容,JMK325BJ107MM-T非常适合自动化生产线焊接,适合高效的批量生产。其平坦的底部设计确保与PCB的良好贴合,增强了电气接触的可靠性。
在传统的SMT印刷线路板技术中,安装时特别需要注意电容器的极性和方向,确保其正确安放于指定位置,避免短路或元件损坏。焊接后,推荐进行电气测试,以确保电容的功能正常。
JMK325BJ107MM-T电容器以其优良的性能和可靠性,成为现代电子产品中不可或缺的重要元件。无论是在开关电源、音频设备还是消费电子领域,其出色的滤波性能和电源管理功能大大提升了设备的整体性能和稳定性。其高效的生产方式和电子应用的广泛性,使其在市场上表现出色,是电子工程师在电路设计中重要的选择之一。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products