WMSIC Electronic Components

TAIYO YUDEN MSASE32MSB5476MTNA01 Multilayer Ceramic Capacitor MSASE32MSB5476MTNA01

ModelMSASE32MSB5476MTNA01
Package1210
BrandTAIYO YUDEN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
TAIYO YUDEN MSASE32MSB5476MTNA01
Type
TAIYO YUDEN
Minimum package
500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TAIYO YUDEN
Electronic Component
MSASE32MSB5476MTNA01
Electronic Component
1
Electronic Component
47uF
Package
1210
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±20%
Electronic Component
0.165g
Electronic Component
1
Electronic Component
BM0220394586
Electronic Component
X5R
Voltage
16V
Electronic Component
Electronic Component
Electronic Component
500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:MSASE32MSB5476MTNA01

一、基本信息

产品名称: MSASE32MSB5476MTNA01
产品类型: 贴片电容
型号: X5R 476M
电容量: 47μF
额定电压: 16V
电容量公差: ±20%
封装类型: 1210 (3225公制)
厚度: 0.3mm
品牌: TAIYO YUDEN (太诱)

二、产品特点

MSASE32MSB5476MTNA01是一款高性能的贴片电容器,其主要特点包括:

  1. 高电容量: 具备47μF的电容量,适用于需要较大电容的电路设计,比如滤波、去耦和能量储存等。

  2. 广泛的适用电压: 额定电压为16V,能够满足多数应用场景中对电压的要求,增强了其适用性。

  3. 优越的温度特性: X5R材料能够在-55℃至+85℃的温度范围内稳定工作,是电子设备在不同操作环境下的重要保障。

  4. 紧凑的封装设计: 1210封装(3225公制)的设计,厚度仅为0.3mm,适合现代电子设备日益缩小的空间需求。

  5. 耐久性和可靠性: 采用TAIYO YUDEN的高质量制造工艺,MSASE32MSB5476MTNA01电容器在长期工作和高频率操作中,表现出优异的稳定性和耐久性。

三、应用场景

MSASE32MSB5476MTNA01贴片电容通常应用于多种电子设备和电路中,具体包括:

  1. 消费电子: 可以广泛运用于智能手机、平板电脑、笔记本电脑等消费类电子设备的电源滤波和去耦电路中。

  2. 通信设备: 在无线通信、电信基站、路由器等设备中,能帮助稳定电源,提供更清晰的信号。

  3. 汽车电子: 用于电动汽车及传统汽车中的各种电子控制单元,承担滤波、耦合等功能,提高整车的电气稳定性和安全性。

  4. 工业设备: 在工业自动化、控制系统中,负责噪声的滤除和电源的去耦,确保设备在复杂环境下的可靠运行。

四、技术参数

  1. 电容量: 47μF
  2. 额定电压: 16V
  3. 容差: ±20%
  4. 温度特性: X5R (-55°C to +85°C)

五、优势分析

  1. 高性价比: 融合了高电容量与小体积的特性,使得MSASE32MSB5476MTNA01在市场中具备较高的性价比,适合批量生产与应用。

  2. 性能稳定: X5R材料技术保证了产品在高频环境中的性能稳定,能够在多种高要求的应用场合中可靠工作。

  3. 方便安装: 贴片设计使得其可方便地应用于自动化生产线,提高了产品的生产效率和一致性。

六、结论

总之,MSASE32MSB5476MTNA01是一款性能优越、可靠性高、应用广泛的贴片电容器。TAIYO YUDEN以其卓越的制造工艺为后盾,结合了高容量和紧凑设计,确保了其在各类电子设备中扮演着重要的角色。凭借其适应性和稳定性,该电容为设计工程师提供了一个理想的选择,能够满足现代电子产品对电源管理和信号完整性的高标准需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.