Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TAIYO YUDEN UMJ325AB7475KMHP Multilayer Ceramic Capacitor UMJ325AB7475KMHP
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- TAIYO YUDEN UMJ325AB7475KMHP
- Type
- TAIYO YUDEN
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TAIYO YUDEN
- Electronic Component
- UMJ325AB7475KMHP
- Electronic Component
- 1
- Electronic Component
- 4.7uF
- Package
- 1210
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.165g
- Electronic Component
- 1
- Electronic Component
- BM0231139273
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 1000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
UMJ325AB7475KMHP 产品概述
一、产品简介
UMJ325AB7475KMHP 为 TAIYO YUDEN（太诱）生产的一款高容量多层陶瓷贴片电容（MLCC），额定电压 50V，标称电容 4.7µF，标称容差 ±10%，介质类型 X7R，封装 1210（公制约 3.2 × 2.5 mm）。此器件属于通用功率去耦与滤波用的高容值 MLCC 系列，适合在中高电压电源轨及 DC–DC 转换器输出侧使用。
二、主要电气特性
- 标称容量：4.7µF（±10%）
- 额定电压：50V DC
- 介质：X7R（-55°C 至 +125°C 温度范围内具有较好稳定性）
- 典型特性：低 ESR、低感抗，适合高频去耦与能量储存 注意：X7R 为高介电常数材料，存在显著的直流偏压效应（DC bias），在较高静态偏压下实际可用电容会下降，设计时应依赖厂商的 DC-bias 曲线或评估实测值以保证有效容量。
三、封装与机械信息
1210 尺寸便于在面向功率的 PCB 布局中提供较大电容量与较低等效串联电感（ESL）。该款 MLCC 采用表面终端，焊接可靠性良好，但对机械应力（如 PCB 弯曲）敏感，需注意装配与后焊工艺管理以防裂纹。
四、典型应用
- 开关电源输出滤波与储能电容（DC–DC、LDO 输出侧）
- 中高压电源总线的去耦与旁路
- 工业与消费电子的电源滤波、纹波抑制 在需要极高稳定性的模拟耦合或对介质吸收敏感的应用（如高精度模拟前端、耦合电容）则需谨慎评估是否使用 MLCC。
五、设计与布局建议
- 靠近被去耦器件的电源引脚放置，走线最短最粗，减少环路面积。
- 若单个器件在工作偏压下容量下降明显，可并联多个电容以增加有效容量并降低 ESR/ESL。
- 注意热源（功率管、稳压器）与电容之间的相对位置，避免长期高温导致寿命下降。
- 按厂商推荐的回流焊曲线进行焊接，避免重复高温循环引起裂纹。
六、可靠性与使用注意
- MLCC 对机械应力敏感，PCB 设计应避免在器件边缘产生弯曲应力，安装后若板面需弯折应先评估风险。
- 长时间储存或受潮后需按规范回流焊前预处理（参考厂商储存与干燥说明）。
- 如应⽤环境有更严格的可靠性或认证要求（如汽车 AEC‑Q200），请确认该型号的相关资质或选用对应认证产品。
七、选型与验证建议
在最终设计中建议参考 TAIYO YUDEN 的完整数据手册，获取 DC-bias 曲线、等效串联阻抗（ESR/ESL）、温度特性及推荐焊接工艺参数。针对目标工作电压与温度条件做实样测试，验证实际有效电容与热性能，必要时通过并联或改换介质/封装来满足系统需求。
总结：UMJ325AB7475KMHP 在 50V 电源系统中提供较高的表面贴装电容量，适用于一般电源去耦与滤波场合；设计时重点关注 DC‑bias、热管理与机械应力以确保长期可靠性。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
