WMSIC Electronic Components

TAIYO YUDEN LB3218T101M Inductor LB3218T101M

ModelLB3218T101M
Package1207
BrandTAIYO YUDEN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TAIYO YUDEN LB3218T101M
Type
TAIYO YUDEN
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TAIYO YUDEN
Electronic Component
LB3218T101M
Electronic Component
1
Package
1207
Type
Inductor
Electronic Component
SMD Inductor
Electronic Component
±20%
Electronic Component
0.064g
Inductor
100uH
Electronic Component
1
Electronic Component
BM0263672929
Current
140mA
Frequency
8MHz
Resistor(DCR)
2.4Ω
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LB3218T101M 产品概述

一、产品简介

LB3218T101M 是太陽誘電(TAIYO YUDEN)推出的一款绕线片式贴片电感,封装规格为 1207(公制 3218,约 3.2 × 1.8 mm)。该器件标称电感值为 100 μH,公差 ±20%,额定直流电流 140 mA,直流电阻(DCR)约 2.4 Ω,自谐振频率(SRF)约 8 MHz。产品适合对体积和成本有要求的低频滤波与阻抗匹配场合。

二、主要规格参数

  • 电感值:100 μH ±20%
  • 额定电流:140 mA(持续直流)
  • 直流电阻(典型):2.4 Ω
  • 自谐振频率:≈ 8 MHz
  • 类型:绕线片式电感(Wire-wound chip)
  • 封装:1207 / 3218(公制 3.2 × 1.8 mm)
  • 品牌:太陽誘電(TAIYO YUDEN)

三、性能特点

  • 小体积高感值:在 1207 小型封装中实现 100 μH,为空间受限的电路提供解决方案。
  • 绕线结构:磁通集中,适合直流偏置较低的应用场景。
  • 明确的自谐频率:SRF ≈ 8 MHz,低于此频率时表现为理想电感;高于 SRF 时电感值迅速下降并趋向容性。
  • 较高的 DCR:约 2.4 Ω,意味着在大电流或要求低损耗的场合需注意功耗与温升。

四、典型应用场景

  • 低频滤波电路(如音频滤波、电源输入滤波)
  • 降噪与 EMI 抑制(与电容配合形成 LC 滤波网络)
  • 传感器前端与信号调理(对低频信号进行隔离)
  • 便携式设备的次级电路(需注意电流与功耗限制)

五、选型与使用建议

  • 工作频率:建议在低于自谐振频率(8 MHz)范围内使用,避免进入谐振区导致性能异常。
  • 电流裕量:额定电流 140 mA 为器件在规定温升条件下的最大值,长期工作建议留有余量并根据实际温升进行降额设计。
  • 损耗考量:DCR 较大,若电路对功耗或热量敏感,应优先考虑低 DCR 型号或采用多绕线并联方案(若可行)。
  • 测量与验证:常用 LCR 表在规定测试频率(厂家资料通常提供)下测量电感;注意测试电平和偏置电流对读数的影响。

六、焊接与可靠性注意事项

  • 采用标准无铅回流工艺,遵循元件制造商推荐的回流曲线,避免超出温度极限。
  • 焊盘设计应匹配 1207 尺寸,保障良好焊接可焊性及机械牢固性。
  • 避免在回流或后工序中施加过大机械应力,以免影响绕线结构与接触可靠性。

七、包装、储存与检验

  • 按照厂商包装(卷带或托盘)储存,避免潮湿与剧烈温度变化。
  • 在使用前建议进行外观与电气抽检:检查电感值、DCR 与绝缘完整性。
  • 对关键应用建议做温升测试与长期老化验证,确认在目标环境下的稳定性。

总结:LB3218T101M 以紧凑封装实现较高电感值,适合空间受限的低频滤波和去耦场合。但由于直流电阻偏高,需在选型与布局时考虑功耗与温升,必要时做降额处理或选择更低 DCR 的同类产品。若需更详细的封装尺寸图、回流曲线或全量程电气曲线,建议查阅太陽誘電官方数据手册。

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