WMSIC Electronic Components

TE Connectivity 63824-1

Model63824-1
PackageThrough-hole
BrandTE CONNECTIVITY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TE Connectivity 63824-1
Type
TE CONNECTIVITY
Minimum package
10000 卷

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TE CONNECTIVITY
Electronic Component
63824-1
Electronic Component
1
Package
Through-hole
Electronic Component
Solder Terminal Block
Electronic Component
0.45g
Electronic Component
1
Electronic Component
BM0264936375
Electronic Component
6.35mm
Electronic Component
1
Electronic Component
Electronic Component
Electronic Component
2
Electronic Component
positions
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

63824-1 产品概述

一、产品简介

63824-1 为 TE Connectivity(泰科电子)系列的线对板连接器端子,属于 250(0.250" / 6.35mm)尺寸的快速断开(TAB)型端子家族。该端子为插件(Through‑hole)封装,设计用于将单片扁平插片与印制电路板可靠连接,适用于需要可插拔或焊接固定的电源与信号传输场合。产品特点包括插片宽度标准化(6.35mm)、单插片结构、双焊脚加固设计以及本体表面镀锡,并带定位结构以便于装配与定位。

二、主要参数

  • 插片宽度:6.35 mm(0.250 英寸)
  • 插片数量:1(单刀片)
  • 焊脚数量:2(双焊脚支撑/固定)
  • 附加特征:带定位(便于安装定位与防错配)
  • 表面处理:本体镀锡(提高焊接性、抗氧化)
  • 封装方式:插件(Through‑hole)
  • 品牌:TE Connectivity(泰科电子)

(注:上表为基于提供信息的关键参数;电气额定值、耐温和材料具体型号请以 TE 官方数据手册为准。)

三、结构与材料说明

63824-1 的结构以单一 6.35mm 宽的扁平插片为核心,插片一侧配合两根焊脚穿过 PCB 孔位进行焊接定位。双焊脚设计除了提供电气接触点外,还在机械上增强了板端的抗拉、抗剪性能,避免插拔或振动导致松脱。产品本体镀锡,锡层有利于提高可焊性与长期可靠性,但在苛刻环境(如高湿、化学腐蚀)中需注意防护或选用镀锡以外的表面处理。带定位特征通常为塑形或凸台,可在自动贴装或人工装配时准确对齐位置,降低错位焊接风险。

四、典型应用场景

  • 电源连接:DC 电源输入/输出与外部线缆的快速连接/断开。
  • 工业控制:控制箱内模块与外设之间的可插拔接插件。
  • 家电与消费电子:需要频繁拆装或维修的电气接口。
  • 汽车电子(非关键安全回路,需确认温度及振动规格):用于辅助电路或车载配件。
  • 仪器设备与测试台:便于快速接线和模块化维护的连接点。

五、安装与焊接建议

  • PCB 设计:为双焊脚预留合适孔径与铜箔焊盘,保证焊接面积及机械强度。根据插片厚度与焊脚直径调整孔径,留出插片侧的清扫及绝缘距离。
  • 焊接工艺:推荐波峰或手工焊接工艺。由于本体镀锡,可获得良好润湿性;焊接温度与时间应遵循锡料与 PCB 的工艺规范,避免过热导致镀层或基材损伤。
  • 定位与夹持:利用端子带定位特征在贴装或送料时固定位置,焊接前应确认插片垂直与焊盘接触良好。
  • 机械强度:若用于承受较大拔力或频繁插拔,应评估是否需在 PCB 上增加加固结构或使用机械夹持件以分散应力。
  • 清洗与防护:焊后若需清洗,选择与镀锡兼容的清洗剂;在潮湿或腐蚀环境,应考虑额外涂覆或密封处理。

六、选型与采购建议

  • 确认电气要求:在选型前核对最大电流、接触电阻与额定电压,若需求高电流或高温环境,可能需要不同材质或更大截面的端子。
  • 环境与法规:确认产品是否满足 RoHS / REACH 等环保要求及所处行业的特殊认证(如汽车级、UL 认证等)。
  • 兼容性:250 系列插片为行业常见尺寸,兼容性较好,但仍建议核对插拔配合的母端、护套及配件规格。
  • 备货与替代:如长期量产,建议与授权分销商或 TE 直接对接,确认交期与批次一致性;同时评估可替代型号以避免单一供应风险。

七、常见问题与注意事项

  • 插拔寿命:频繁插拔会引起镀层磨损或接触不良,应根据使用频率评估寿命并考虑使用插拔耐久性更高的配套件。
  • 焊接后变形:焊接温度与焊接时间控制不当可能导致端子或定位结构变形,影响插入配合。
  • 表面镀锡限制:镀锡便于焊接但对长期暴露在高温或化学介质下的耐蚀性有限,必要时选择镀镍/镀金等更高等级处理。
  • 机械载荷:插片在实际使用中可能受到侧向力或弯曲载荷,应在结构设计时考虑应力传递路径,避免损伤焊点或 PCB。

结语:63824-1 作为 TE Connectivity 的 6.35mm 250 TAB 系列端子,结构简单、装配方便,适合多种通用电源与信号连接场合。为确保匹配您的具体应用,请在最终设计与量产前参考 TE 官方数据手册并与供应商确认电气与机械详细规格。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.