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TE Connectivity 5100143-1
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TE Connectivity 5100143-1
- Type
- TE CONNECTIVITY
- Minimum package
- 10 管
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TE CONNECTIVITY
- Electronic Component
- 5100143-1
- Electronic Component
- 1
- Package
- Through-hole
- Electronic Component
- 5
- Electronic Component
- and Connector
- Electronic Component
- 14.3g
- PIN
- 110P
- Electronic Component
- 1
- Electronic Component
- BM0265069863
- Electronic Component
- Through-hole
- Operating Temperature
- 55℃~+125℃
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Current
- 1.5A
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
5100143-1 产品概述
一、产品简介
5100143-1 为 TE Connectivity（泰科电子） Z‑PACK 2.00mm HM 系列的背板/插头型连接器，属于高密度夹层式直插（插件） PCB 安装件。该件为垂直式、22 列 × 5 排共 110 针的矩阵排列，中心线间距 2.00 mm（0.078 in），适用于低速至 ≤1 Gb/s 的板对板或背板连接场合。
二、主要规格
- 引脚数：110P（22 列 × 5 排）
- 中心距：2.00 mm（0.078 in）
- 额定电流：1.5 A/针
- 工作温度：-55 ℃ 至 +125 ℃
- 安装方式：直插（Through‑Hole）垂直安装
- 外观颜色：灰色（外壳/绝缘体）
三、结构与材料
- 触头材质：磷青铜（Phosphor Bronze），兼顾导电性与弹性恢复性能。
- 触头镀层：金（Gold），提高接触可靠性、耐腐蚀性及低接触电阻，适合多次插拔或长期接触要求。
- 结构类型：夹层式（mid‑mount/mezzanine 风格），适配背板与插头之间的压合/对接连接，布局紧凑以节省板上空间。
四、电气与环境性能
该连接器适用于信号传输与轻载电源或控制回路，单针额定电流 1.5A，满足一般数字信号与弱功率供电需要。工作温度范围宽 (-55 ℃~+125 ℃)，适应工业级或苛刻温度环境。金镀触头与磷青铜基材保证低接触电阻与优良的环境耐受性。
五、装配与使用建议
- 插件（直插）焊接时，请根据 PCB 板厚与孔径规范选择合适的焊接工艺（波峰或选择性回流并配合通孔焊），避免过高温度影响绝缘体或镀层。
- 装配过程中避免侧向过大力矩，推荐垂直插拔以延长触头寿命。
- 在设计 PCB 布局时，考虑散热与走线空间，确保夹层连接后的导通与机械强度要求。
六、典型应用场景
- 背板与子板互连（计算、通信设备）
- 工业控制系统内部板对板连接
- 通信设备机箱内高密度信号互连（≤1 Gb/s 的以太网等）
- 嵌入式系统、测试设备和仪器仪表的模块化连接
七、选型与兼容性提示
在选择 5100143-1 时，请确认配对连接器（母座/插座）的型号及排布一致，同时核实 PCB 钻孔与焊盘尺寸、板厚及机械固定方式。若需更高电流、不同接触材料或更高速率传输（>1 Gb/s），可考虑 TE 其他系列或不同间距的产品以满足特定需求。
如需进一步的机械图纸、3D 模型、耐久循环或详细焊接参数，可通过 TE 官方资料或授权分销商获取完整数据手册与应用说明。
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