WMSIC Electronic Components

TECH PUBLIC TPESD5451N

ModelTPESD5451N
PackageDFN1006-2
BrandTECH PUBLIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TECH PUBLIC TPESD5451N
Type
TECH PUBLIC
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TECH PUBLIC
Electronic Component
TPESD5451N
Electronic Component
1
Package
DFN1006-2
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.007g
Electronic Component
1
Cj- Capacitor
15pF
Electronic Component
BM0228740068
Voltage
10V
Electronic Component
IEC 61000-4-5;IEC 61000-4-2
Current(Ir)
80nA
Voltage(VBR)
8.4V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TPESD5451N 产品概述

TPESD5451N 是台舟电子(TECH PUBLIC)推出的一款低电容、面向 5V 接口的瞬态电压抑制器(TVS/ESD),用于对静电放电(ESD)和雷击/浪涌(Surge)冲击提供高效保护。器件以 DFN1006-2 小封装实现,适合高密度板级保护与高速信号线应用。

一、主要参数与性能亮点

  • 类型:ESD/TVS 双重保护器件(静电 + 浪涌)
  • 反向截止电压 Vrwm:5V(适合 5V 系统)
  • 击穿电压(Vbr):8.4V(典型)
  • 钳位电压(Vc):10V(峰值)
  • 峰值脉冲功率 Ppp:80W(8/20µs)
  • 峰值脉冲电流 Ipp:8A(8/20µs)
  • 结电容 Cj:15pF(低电容,支持高速信号)
  • 反向漏电流 Ir:≤80nA(静态功耗低)
  • 防护等级:符合 IEC 61000-4-2(ESD)和 IEC 61000-4-5(浪涌)测试规范
  • 封装:DFN1006-2(体积小,适合贴片自动化)

二、典型应用场景

  • USB、HDMI、LVDS、CAN 等 5V 或近 5V 的接口和数据线保护
  • 手机、平板、便携设备的外部接口防护
  • 工业控制器、仪表的弱信号输入口防雷击与静电干扰
  • 高密度主板或模块上对单端/差分信号线的板级保护

三、应用与布局建议

  • 将 TPESD5451N 放置在被保护端口与 PCB 地之间,尽量靠近连接器或外露引脚,缩短环路面积以降低感性耦合。
  • 对高速信号线,15pF 低结电容有利于信号完整性,但仍建议在需要时与外部串联阻抗或共模电感配合使用。
  • 使用低阻抗地平面并增加一颗或多颗过孔(vias)将器件接地端快速导入主地,减小接地回路感抗。
  • 遵循 DFN1006-2 的推荐焊盘与热扩散设计,确保良好焊接和热耗散。

四、选型与可靠性要点

  • 若目标为 5V 信号线保护,Vrwm=5V 与 Vbr=8.4V 的组合可在正常工作电压下保持高可靠性,同时在瞬态事件发生时将电压钳位至约 10V,保护下游器件。
  • 80W(8/20µs)脉冲能量和 8A 峰值脉冲电流,适合常见的线路浪涌与测试等级,符合 IEC 标准要求。
  • 漏电流极小(≤80nA),适合电池供电与低功耗场合。
  • 生产选型时关注实际系统的最大可承受钳位电压与下游器件耐压,必要时可并联或采用更高功率等级 TVS 作为一级保护。

五、封装与焊接注意

  • DFN1006-2 小封装利于高密度设计,推荐使用回流焊工艺,注意焊盘的湿润性和回流曲线控制以避免虚焊或焊接缺陷。
  • 焊盘设计建议参考厂商推荐脚位图,保证接地过孔布局合理以利于热量与冲击能量的快速分散。

TPESD5451N 以其低电容、高能量吸收能力和小封装特性,在对抗静电放电与线路浪涌的同时,能兼顾信号完整性与板级空间效率,适用于消费电子与工业接口的可靠防护。若需具体电气曲线(I-V、钳位特性)或推荐参考电路图,可联系台舟电子获取完整器件数据手册与参考设计。

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