WMSIC Electronic Components

TECH PUBLIC DMG1012T

ModelDMG1012T
PackageSOT-523-3
BrandTECH PUBLIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TECH PUBLIC DMG1012T
Type
TECH PUBLIC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TECH PUBLIC
Electronic Component
DMG1012T
Electronic Component
1
Package
SOT-523-3
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.033g
Electronic Component
1
Electronic Component
BM0226539277
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
280mW
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
20V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

DMG1012T 产品概述

一、产品简介

DMG1012T 是 TECH PUBLIC(台舟电子)推出的一款小封装 N 沟道增强型场效应管(MOSFET),适用于空间受限、低压小电流的开关和功率管理场合。器件耐温范围宽(-55℃~+150℃),在 2.5V 门极驱动下仍能提供较小的导通电阻,适合便携式设备与低压电源前端应用。

二、主要参数

  • 类型:N 沟道 MOSFET
  • 漏源电压 Vdss:20 V
  • 连续漏极电流 Id:800 mA
  • 导通电阻 RDS(on):300 mΩ @ Vgs=2.5 V
  • 阈值电压 Vgs(th):1.1 V @ Id=250 μA
  • 耗散功率 Pd:280 mW
  • 输入电容 Ciss:120 pF
  • 输出电容 Coss:20 pF
  • 反向传输电容 Crss:15 pF
  • 封装:SOT-523-3(超小型)
  • 工作温度:-55℃~+150℃
  • 数量:1 个 N 沟道

三、关键特性

  • 低电压驱动:Vgs(th)≈1.1V,在 2.5V 门驱下导通电阻为 300 mΩ,适合低电压逻辑电平驱动。
  • 小体积封装:SOT-523-3,节省 PCB 面积,适合移动设备与高密度布局。
  • 低输入/输出电容:Ciss 和 Coss 较小,有利于减小驱动能耗与提高开关速度。
  • 宽温度范围与稳健可靠性,适合工业级环境。

四、典型应用

  • 便携式电源开关与负载切换(智能手机配件、蓝牙耳机等)
  • 电源管理 IC 外围开关、反向保护开关
  • 低压小电流驱动场景(信号开关、驱动小型继电器)
  • 电池供电系统与充放电路径控制

五、使用建议与注意事项

  • 功率与电流限制:在最大 Id(800 mA)下器件功耗接近限值(I^2·R ≈0.19 W),建议在实际设计中考虑 PCB 铜箔散热与环境温度的降额使用。
  • 开关速度与振铃控制:门极电阻与寄生电容(Ciss、Crss)影响开关过渡及电磁兼容,必要时在门极串联阻尼。
  • 过压与瞬态保护:20 V 耐压限制在汽车或工业高瞬态场景需外加 TVS 或限压措施。
  • 布局建议:尽量缩短漏源回流路径,增大散热铜箔面积,保证热阻最低。
  • ESD、防反接保护:SOT-523-3 封装体积小,易受静电影响,建议在生产与上板阶段做好防静电与保护设计。

六、封装与订购信息

  • 品牌:TECH PUBLIC(台舟电子)
  • 封装:SOT-523-3(3 引脚)
  • 型号:DMG1012T
    如需样片或批量采购,请提供工作环境说明与应用场景,以便选型与可靠性评估。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.