Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TECH PUBLIC PMEG6020ER
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TECH PUBLIC PMEG6020ER
- Type
- TECH PUBLIC
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TECH PUBLIC
- Electronic Component
- PMEG6020ER
- Electronic Component
- 1
- Package
- SOD-123FL
- Electronic Component
- Schottky Diode
- Electronic Component
- 1g
- Electronic Component
- 1
- Electronic Component
- BM0264777502
- Current
- 2A
- Diode
- 1
- Current(Ir)
- 200uA
- (Vf)
- 700mV@2A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
PMEG6020ER 产品概述
一、产品简介
PMEG6020ER 是 TECH PUBLIC（台舟电子）推出的一款独立式整流二极管，封装为 SOD-123FL，适用于表面贴装电路。主要电气参数如下：正向压降 Vf ≈ 700 mV（在 If = 2 A）；最大直流反向耐压 Vr = 60 V；额定整流电流 If(AV) = 2 A；反向漏电流 Ir = 200 μA；非重复峰值浪涌电流 Ifsm = 50 A；工作结温范围为 -55 ℃ ～ +150 ℃。该器件面向需要中等电流整流和开关保护的应用场景。
二、主要特性
- 低正向压降：2 A 工作点下 Vf 约 0.7 V，有利于降低导通损耗，提高效率。
- 合理的耐压等级：60 V 适用于多数单节或低压母线的整流与保护。
- 中等整流能力：2 A 连续电流满足常见便携电源、充电与接口保护需求。
- 高脉冲浪涌能力：Ifsm = 50 A，能承受瞬态冲击电流（非重复）。
- 宽温度范围：结温上限 150 ℃，适合高温工作环境。
- SOD-123FL 封装：适配自动化贴装，体积小，有利于高密度 PCB 布局。
三、典型应用
- 开关电源输出整流、续流二极管
- 充电器与适配器的整流与反向保护
- 反向电池保护、电源输入保护（欠压/反接防护）
- 通信设备、仪表、车载电子（非高压主电路）中的整流与保护
- 一般功率管理与接口隔离电路
四、热管理与功耗估算
在 If = 2 A 且 Vf ≈ 0.7 V 时，理论瞬时功耗约为 P = Vf × If ≈ 1.4 W。实际散热能力受封装、PCB 铜箔面积与环境温度影响显著。使用时应注意以下要点：
- 设计合理的铜箔散热区域（焊盘与散热线）以降低结温；
- 在高占空比或连续大电流工况下需做温升评估并留有余量；
- 注意反向漏电随温度上升而增加，需在高温工况下进行验证。
五、封装与焊接建议
PMEG6020ER 的 SOD-123FL 封装适合无铅回流工艺与自动贴片生产。建议依据台舟电子提供的推荐焊盘尺寸和回流曲线进行加工，确保焊接可靠性与机械强度，同时遵循行业通用的湿热与温度循环可靠性测试规范。
六、选型与可靠性注意事项
在最终选型时应确认具体工况下的动态参数（例如反向恢复时间、温度下的 Ir 增长、封装热阻等），并与系统容差匹配。对于长期承受冲击电流或高温环境的应用，建议适当降额使用或选择更高 Ifsm/更大散热能力的器件。有关更详细的试验条件与典型特性，请参照厂方完整技术资料与样片测试结果。若需样片或批量采购，请联系 TECH PUBLIC（台舟电子）授权渠道获得最新数据表与质量保证信息。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
