WMSIC Electronic Components

TECH PUBLIC BAT46WS

ModelBAT46WS
PackageSOD-323FL
BrandTECH PUBLIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TECH PUBLIC BAT46WS
Type
TECH PUBLIC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TECH PUBLIC
Electronic Component
BAT46WS
Electronic Component
1
Package
SOD-323FL
Electronic Component
Schottky Diode
Electronic Component
0.033g
Electronic Component
1
Electronic Component
BM0264777479
Current
250mA
Diode
Electronic Component
Current(Ir)
9uA@100V
(Vf)
850mV@250mA
Electronic Component
Electronic Component
Electronic Component
3000
Voltage Rating(Vr)
100V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BAT46WS(TECH PUBLIC 台舟电子)产品概述

一、产品简介

BAT46WS 为独立式肖特基二极管,品牌为 TECH PUBLIC(台舟电子),封装为 SOD-323FL。器件针对小信号与低功耗整流、快速开关与反向保护等场景设计,兼顾较高反向耐压与小尺寸封装,适合集成度高的移动与消费类电子产品。

二、主要参数与性能特点

  • 正向压降(Vf):850 mV @ 250 mA(在满载工作点下仍保持较低压降,有利于降低功耗)
  • 直流整流电流(If):250 mA(持续电流能力,适合小功率整流)
  • 直流反向耐压(Vr):100 V(适合较高电压环境下的反相保护与开关应用)
  • 反向电流(Ir):9 μA @ 100 V(在高压下仍保持低反向泄漏,利于待机与高阻抗电路)
  • 非重复峰值浪涌电流(Ifsm):2.5 A(适用于偶发短时浪涌,满足突发能量吸收)
  • 封装:SOD-323FL(超小型表贴,适合高密度 PCB 布局)

三、典型应用

  • 电源管理:小电流整流、二次侧整流、极性反接保护
  • 通信与射频前端:检波、限幅与快速开关
  • 工业及消费电子:备用电池切换、充电管理、浪涌抑制
  • 仪表与传感器:低功耗检测电路、混频与检波应用

四、封装与机械特性

SOD-323FL 封装体积小、引脚间距短,利于自动贴装与回流焊工艺。建议在焊盘设计时保留足够焊盘面以保证热传导与机械强度;对需要散热的应用,可在 PCB 下方添加铜箔或热通孔以改善热阻。

五、设计与布局建议

  • 尽量缩短器件与相关电感、电容之间的走线,减小寄生电感与串联阻抗。
  • 对于观察到的较高正向压降(850 mV @250 mA),在电源效率敏感场景需评估功耗与温升,必要时考虑并联或更大规格器件。
  • 在高电压、低漏电要求的应用中,合理预留反向电压裕量,并注意焊接温度与应力对反向漏流的影响。
  • 浪涌保护仅限短时非重复峰值能力(Ifsm 2.5 A),如需频繁浪涌承受,应选用专用浪涌抑制器或更大规格二极管。

六、注意事项与可靠性

  • 器件在高温或高电流下会升高结温,应遵循厂商的功率-温度降额曲线以保证长期可靠性。
  • 出厂前应保证包装防潮等级,避免回流焊前未做适当回流干燥导致元件吸湿炸裂。
  • 建议在样机阶段进行电气与热仿真、寿命与ESD试验,验证在实际工况下的性能与可靠性。

如需详细的温升曲线、结壳热阻或完整的最大额定值(Absolute Maximum Ratings)与典型特性曲线,可向 TECH PUBLIC(台舟电子)索取器件数据手册以完成最终设计验证。

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