WMSIC Electronic Components

TECH PUBLIC TPESD5B5.0ST1G

ModelTPESD5B5.0ST1G
PackageSOD-523
BrandTECH PUBLIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TECH PUBLIC TPESD5B5.0ST1G
Type
TECH PUBLIC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TECH PUBLIC
Electronic Component
TPESD5B5.0ST1G
Electronic Component
1
Package
SOD-523
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.023g
Electronic Component
1
Cj- Capacitor
15pF
Electronic Component
BM0227700532
Operating Temperature
55℃~+125℃
Voltage
9V
Electronic Component
IEC 61000-4-4;IEC 61000-4-2
Current(Ir)
200nA
Voltage(VBR)
7V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TPESD5B5.0ST1G 产品概述

一、产品简介

TPESD5B5.0ST1G 是由 TECH PUBLIC(台舟电子)推出的一款小封装瞬态电压抑制二极管(TVS / ESD 抑制器),采用 SOD-523 超小封装,专为 5V 工作电压系统的瞬态过压和静电放电(ESD)保护设计。器件响应速度快、漏电流低、峰值脉冲能力强,适合对电路接口、数据线和敏感芯片进行高效防护。

二、主要参数

  • 额定反向工作电压(Vrwm):5 V
  • 击穿电压(VBR):典型 6 V(规格范围可达约 7 V,详见数据表)
  • 钳位电压:9 V(Ipp = 7 A,8/20 μs 波形)
  • 峰值脉冲电流(Ipp):7 A @ 8/20 μs
  • 反向漏电流(Ir):200 nA(在 Vrwm 条件下典型值)
  • 结电容(Cj):15 pF(低电容,适合高速信号)
  • 工作温度范围:-55 °C ~ +125 °C
  • 防护等级与标准:符合 IEC 61000-4-2(静电放电)与 IEC 61000-4-4(电快速瞬变/脉冲群)
  • 封装:SOD-523(超小型,适合高密度 PCB)

三、产品特性

  • 小体积、占板面积小:SOD-523 封装便于移动设备、消费电子和便携式 PCB 的空间布局。
  • 快速钳位、有效吸收瞬态能量:在 8/20 μs 波形下可承受 7A 峰值脉冲,钳位电压控制在 9V 左右,有效保护下游器件。
  • 低漏电与低结电容:200 nA 的低反向漏电与 15 pF 的结电容,兼顾静态功耗与信号完整性,适用于 USB、串口、数据通信等高速接口。
  • 宽温度工作范围:-55 °C 至 +125 °C,可靠性高,适应恶劣工作环境。
  • 满足工业级抗干扰标准:通过 IEC 61000-4-2/4 相关测试,具备良好的抗静电与抗脉冲群能力。

四、典型应用

  • USB、HDMI、MIPI、LVDS 等高速数据接口保护
  • 手机、平板、笔记本等便携设备外部接口防护
  • 工业控制总线、传感器接口的瞬态浪涌防护
  • 消费类电子与物联网设备的 I/O 口保护
  • PCB 上紧靠接口端子或连接器的旁路保护元件

五、使用建议与注意事项

  • 布局原则:器件应尽可能靠近被保护的接口或引脚安装,保护器与被保护线之间走线要短且粗,尽量减少串联阻抗。
  • 接地处理:对于需要参考地的保护电路,应确保良好的接地铜皮和足够的回流孔(vias),以便快速将脉冲能量引入地平面。
  • 热与能量处理:尽管 TPESD5B5.0ST1G 能承受短时大电流脉冲,但长期或重复高能量冲击会影响寿命,设计时应评估系统可能出现的冲击能量与次数。
  • 型号确认:部分应用可能需要单向或双向 TVS,请根据具体电路(单端或双端保护)参考原厂数据表选择合适的器件型号与极性。
  • 焊接与可靠性:遵循 SOD-523 的推荐回流焊工艺与温度曲线,避免长时间高温暴露导致性能退化。

TPESD5B5.0ST1G 以其小尺寸、低电容与较高的冲击吸收能力,为 5V 类电子系统提供了可靠且经济的瞬态与静电防护解决方案。更多详细电气特性与封装信息,请参考 TECH PUBLIC(台舟电子)产品数据手册。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.