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TECH PUBLIC BV03C-H BV03C
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TECH PUBLIC BV03C-H
- Type
- TECH PUBLIC
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TECH PUBLIC
- Electronic Component
- BV03C-H
- Electronic Component
- 1
- Package
- SOD-323
- Electronic Component
- Electronic Component
- Type
- TVS
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.027g
- Electronic Component
- 1
- Channel Count
- Electronic Component
- Cj- Capacitor
- 1pF
- Electronic Component
- BM0264777496
- Voltage
- 16V
- Electronic Component
- IEC 61000-4-4；IEC 61000-4-2
- Current(Ir)
- 200nA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BV03C-H 产品概述
一、产品简介
BV03C-H 是由 TECH PUBLIC（台舟电子）推出的一款低容、双向瞬态电压抑制器（TVS），封装为 SOD-323，单路保护。器件专为低压、高速信号线的静电放电（ESD）和脉冲瞬态浪涌防护而设计，适合 USB2.0、IEEE1394、HDMI、GPIO 等高速数据接口，能在不显著影响信号完整性的前提下提供可靠保护。
二、主要性能参数
- 极性：双向
- 反向截止电压 Vrwm：3.3 V
- 击穿电压 VBR：6 V
- 钳位电压（典型）：16 V
- 峰值脉冲功率 Ppp：350 W @ 8/20 µs
- 反向电流 Ir：200 nA
- 结电容 Cj：1 pF（低容，适合高速信号）
- 通道数：单路
- 防护等级：符合 IEC 61000-4-2（ESD）与 IEC 61000-4-4（EFT）测试要求
- 封装：SOD-323（小体积，便于贴片安装）
三、特点与优势
- 低结电容（约 1 pF），对高速差分/单端信号的影响最小，可保持信号速率与眼图质量；
- 双向结构支持双向瞬态，适用于差分对和非极性应用；
- 高冲击吸收能力：8/20 µs 波形下峰值可达 350 W，能有效钳制高能脉冲；
- 低漏泄电流（典型 200 nA），有利于低功耗系统；
- SOD-323 小封装，节省 PCB 面积，适合移动设备与紧凑型接口板设计；
- 满足 IEC 61000-4-2 / 4-4 标准，提升系统抗扰度，减少现场故障率。
四、典型应用场景
- USB 2.0/高速数据端口保护（上游/下游接口）；
- HDMI、IEEE1394（FireWire）等多媒体接口的静电保护与浪涌抑制；
- 嵌入式系统的 GPIO、UART、I2C 等低电压高速信号线；
- 手机、平板、相机、可穿戴设备以及工业控制接口的浪涌与 ESD 防护。
五、设计与使用建议
- 尽量将 BV03C-H 靠近受保护的连接器或信号源放置，以缩短寄生电感与走线长度，提高保护效率；
- 对双向器件无需方向性考虑，但仍建议参考 PCB 制造商的布局规范，避免长串联阻抗；
- 在对接地要求严格的环境中，确保器件的参考地可靠且低阻抗，必要时加宽地平面或增加过孔；
- 焊接与回流时遵循封装的热工参数与制造商推荐的回流曲线，以保证长期可靠性；
- 在选型时核对系统最大工作电压与 Vrwm（3.3 V）匹配，避免在正常工作条件下进入击穿区域。
BV03C-H 以其低容、高能量吸收与小尺寸封装，为对信号完整性要求严苛的低压高速接口提供经济、可靠的瞬态保护方案。若需进一步的电气曲线、封装尺寸或应用电路示意图，可联系 TECH PUBLIC 或查询相应数据手册。
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