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TECH PUBLIC B5819WT
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TECH PUBLIC B5819WT
- Type
- TECH PUBLIC
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TECH PUBLIC
- Electronic Component
- B5819WT
- Electronic Component
- 1
- Package
- SOD-523
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.027g
- Electronic Component
- 1
- Electronic Component
- BM0257695353
- Current
- 1A
- Diode
- 1
- Current(Ir)
- 40uA@40V
- (Vf)
- 610mV@1A
- Electronic Component
- 40℃~+125℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
B5819WT 产品概述
一、产品简介
B5819WT 是 TECH PUBLIC（台舟电子）提供的一款小型整流二极管，采用 SOD-523 封装，面向空间受限的便携和消费电子设备。器件具有 1A 的整流电流能力和最高 40V 的直流反向耐压，兼顾低正向压降与较低的反向漏电，适合作整流、极性保护及低电压功率路径应用。
二、主要电气参数
- 正向压降 (Vf)：610 mV @ 1A
- 直流反向耐压 (Vr)：40 V
- 连续整流电流：1 A
- 反向电流 (Ir)：40 μA @ 40 V
- 非重复峰值浪涌电流 (Ifsm)：7 A
- 工作结温范围：-40 ℃ ~ +125 ℃
三、性能亮点
- 低正向压降：在 1A 工作电流下 Vf≈0.61V，有助于降低整流损耗与发热，适合对效率有一定要求的电路。
- 小封装优势：SOD-523 体积小，适用于贴片密集的 PCB 布局，便于移动设备与微型模块集成。
- 合理的耐压与浪涌能力：40V 的反向耐压满足常见的系统电压需求，7A 的单次浪涌能力可应对短时启动或浪涌事件。
- 宽温工作范围：-40℃到+125℃，适应工业级温度范围。
四、典型应用场景
- 小功率电源整流输出（降压/升压模块次级整流）
- 电源反向/极性保护（电池与电源路径隔离）
- 移动设备、可穿戴产品的电源管理
- TVS/保护电路的低压偏置路径
- 一般信号整流与钳位场合
五、封装与可靠性
SOD-523 为超小型表面贴装封装，利于高密度布板。由于封装体积小，热阻相对较高，建议在 PCB 设计时注意散热：尽量在焊盘下或周围预留铜箔以利热传导，并在可能的情况下进行器件分布以避免热聚集。
六、使用建议与注意事项
- 在长时间接近额定电流（1A）工作时，应评估结温与 PCB 散热能力，必要时实施降额。
- 反向漏电 Ir 随温度上升会增加，若在高温或高压反向工况下应用，需要留意漏电对系统的影响。
- Ifsm 表示非重复峰值浪涌能力，适用于短时浪涌（例如浪涌启动或突入电流），但不适合作为长期重复冲击载荷。
- SOD-523 为细小封装，焊接时需控制回流温度曲线与时间，避免过热影响可靠性。
七、封装与采购信息
- 品牌：TECH PUBLIC（台舟电子）
- 型号：B5819WT
- 封装：SOD-523
- 描述分类：未分类（通用整流用途）
总结：B5819WT 凭借低 Vf、适中的耐压和小体积封装，是面向小功率整流与电源保护应用的实用选择。在设计时重视散热和温度对漏电与可靠性的影响，可发挥其在便携与高密度产品中的优势。
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