WMSIC Electronic Components

TECH PUBLIC PESD12VL2BT

ModelPESD12VL2BT
PackageSOT-23
BrandTECH PUBLIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TECH PUBLIC PESD12VL2BT
Type
TECH PUBLIC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TECH PUBLIC
Electronic Component
PESD12VL2BT
Electronic Component
1
Package
SOT-23
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.032g
Electronic Component
1
Cj- Capacitor
15pF;8pF
Electronic Component
BM0226538752
Operating Temperature
55℃~+125℃
Voltage
10V
Electronic Component
IEC 61000-4-4;IEC 61000-4-5;IEC 61000-4-2
Current(Ir)
50nA
Voltage(VBR)
17.5V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PESD12VL2BT 产品概述

一、主要特性

PESD12VL2BT 是一款面向讯号线和电源线的瞬态浪涌/静电放电保护器件,由 TECH PUBLIC(台舟电子)提供。器件类型为 ESD 二极管,封装为 SOT-23。主要特性包括:钳位电压 10 V、反向耐压(Vrwm)12 V、击穿电压 17.5 V、峰值脉冲功率 80 W(8/20 μs),峰值脉冲电流 8 A(8/20 μs),结电容典型值 15 pF(另有 8 pF 低容版本可选),反向漏电流仅 50 nA,工作温度范围 -55 ℃ 至 +125 ℃。

二、典型电气参数

  • 钳位电压 VC:10 V(典型,测试条件请参见器件数据手册)
  • 反向截止电压 Vrwm:12 V
  • 击穿电压 Vbr:17.5 V
  • 峰值脉冲功率 Ppp:80 W @ 8/20 μs
  • 峰值脉冲电流 Ipp:8 A @ 8/20 μs
  • 结电容 Cj:15 pF(常规);8 pF(低容型)
  • 反向电流 Ir:50 nA(典型)
  • 工作温度:-55 ℃ ~ +125 ℃

三、适用场景

适用于需要对高速数据线、控制线和低压电源线进行瞬态保护的各种电子设备,例如:

  • USB/HDMI/串口等接口保护
  • 工业控制与测量设备接口防护
  • 通信设备、路由器、交换机 I/O 保护
  • 汽车电子非车内高压防护(遵循应用规范)

四、封装与安装

SOT-23 小型封装,便于高密度布板与自动贴装。建议按照制造商推荐的 PCB 焊盘布局进行布线,尽量靠近受保护引脚接地以最小化串联感抗和回路面积。

五、兼容的抗扰标准

器件设计用于满足常见的瞬态抗扰要求,兼容 IEC 61000-4-2(静电放电)、IEC 61000-4-4(快速瞬变脉冲群)和 IEC 61000-4-5(浪涌)级别的系统防护需求(最终抗扰性能以整机测试为准)。

六、设计与使用建议

  • 将器件靠近需保护的接口引脚放置,接地端的走线应粗短直。
  • 对于高速差分信号,请优先选用低结电容(8 pF)型号以降低信号失真。
  • 峰值保护能力有限,不适合承受重复或长时间的大能量冲击;在高能量环境下应与熔断器、线缆保护器等配合使用。
  • 注意焊接温度曲线与热循环能力,避免超过器件规格。

七、可靠性与环境

器件工作温度范围宽,适合工业级应用;小封装利于散热,但在高脉冲能量场合需注意 PCB 散热与能量分配。存储与焊接应遵循湿敏等级和相关回流规范。

八、品牌与采购

品牌:TECH PUBLIC(台舟电子)。封装:SOT-23。型号:PESD12VL2BT。采购与技术支持请联系台舟电子或其授权分销渠道,获取完整数据手册、原理图示例和 PCB 推荐封装信息。

如需器件的具体波形测试曲线、封装尺寸图或在某一应用场景下的布局建议,我可以根据要求提供更详细的参考资料。

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