Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TECH PUBLIC PESD3V3L4UG
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TECH PUBLIC PESD3V3L4UG
- Type
- TECH PUBLIC
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TECH PUBLIC
- Electronic Component
- PESD3V3L4UG
- Electronic Component
- 1
- Package
- SOT-353
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.028g
- Electronic Component
- 1
- Cj- Capacitor
- 0.3pF；0.45pF
- Electronic Component
- BM0230027715
- Operating Temperature
- 55℃~+125℃
- Voltage
- 14V
- Electronic Component
- IEC 61000-4-4；IEC 61000-4-5；IEC 61000-4-2
- Current(Ir)
- 100nA
- Voltage(VBR)
- 4.2V
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
PESD3V3L4UG 产品概述
一、产品简介
PESD3V3L4UG 是 TECH PUBLIC（台舟电子）推出的一款用于 3.3V 器件的静电与浪涌保护二极管（TVS/ESD），采用超小型 SOT-353 封装，专为接口和信号线的瞬态过压防护设计，兼顾低电容以维持高速信号完整性。
二、主要性能参数
- 反向截止电压 Vrwm：3.3 V（用于 3.3V 系统的工作耐压）
- 击穿电压 Vbr：4.2 V（典型）
- 钳位电压 Vclamp：14 V（在 8/20µs 浪涌条件下）
- 峰值脉冲功率 Ppp：80 W（8/20µs）
- 反向漏电流 Ir：100 nA（典型，保证低功耗）
- 结电容 Cj：0.3 pF / 0.45 pF（典型值，随测量条件或型号轻微不同）
- 工作温度范围：-55 ℃ 至 +125 ℃
- 防护等级与兼容标准：符合 IEC 61000-4-2（ESD）、IEC 61000-4-4（EFT）、IEC 61000-4-5（浪涌）
三、典型应用场景
适用于移动设备、通信模块、消费类电子和各种需保护 3.3V I/O 的场合，包括但不限于：
- UART、I2C、SPI 等高速数字接口
- 外围接口（按键、触摸、天线接头）
- 智能传感器与微控制器引脚保护
- 小型数据线与接口（Camera、Display、USB 辅助通道等）
四、封装与可靠性
SOT-353 小型封装适合高密度电路板设计，占板面积小、引脚间距紧凑，方便靠近受保护节点布局。器件满足宽温域工作与工业级可靠性要求，适合长期现场使用。
五、选型与使用建议
- 若需最低对信号影响，优先选择结电容较低的版本（0.3 pF）。
- 若被保护线路可能承受较强浪涌，注意钳位电压 14 V 与系统容许电压的匹配，必要时在前端加串联阻抗或更大功率 TVS。
- 将 TVS 尽可能靠近受保护端口放置，走线短且宽，回流路径直接到共地以降低感性耦合。
- 注意焊接工艺兼容性，遵循厂家回流曲线，避免过热损伤。
六、布局与连接建议
- 将器件放在接口的第一道防线：插座/连线处与主芯片之间，靠近连接器焊盘。
- 保证 TVS 到地的回流路径短且阻抗低；避免共地环路穿过敏感模拟路径。
- 在差分或高速对中，若单端 TVS 可能引入失衡，应考虑对称布置或选用差分保护方案。
PESD3V3L4UG 以其低电容、高能量吸收能力和小型化封装，适合现代 3.3V 系统中对信号完整性和抗扰度有较高要求的保护设计。若需更详细的电气曲线、焊接参数或器件型号对比，建议参阅 TECH PUBLIC 的器件数据手册或联系技术支持。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
