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TECH PUBLIC IRLML2502TRPBF
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TECH PUBLIC IRLML2502TRPBF
- Type
- TECH PUBLIC
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TECH PUBLIC
- Electronic Component
- IRLML2502TRPBF
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- 1 N
- Electronic Component
- MOSFET
- Electronic Component
- 0.029g
- Electronic Component
- 1
- Electronic Component
- BM0219861855
- Operating Temperature
- 55℃~+150℃
- Power Dissipation(Pd)
- 1.25W
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage(Vdss)
- 20V
- Capacitor(Ciss)
- 574pF
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
IRLML2502TRPBF 产品概述
一、产品简介
IRLML2502TRPBF 是一种 N 沟道 MOSFET（金属氧化物半导体场效应晶体管），由 TECH PUBLIC（台舟电子）生产。它被广泛应用于各种电子设备中，尤其是在低电压、小功率应用场景中。该 MOSFET 的主要特点是具备低导通电阻、快速的开关速度以及优良的热性能，使其成为开关电源、负载开关和信号调理电路等应用的理想选择。
二、封装与规格
IRLML2502TRPBF 采用 SOT-23 封装，这是一种小型、节省空间的表面贴装塑料封装，适合用于高密度电路板。SOT-23 封装的结构不仅可以提高安装密度，还能够改善散热性能。该封装的主要参数如下：
- 封装类型：SOT-23
- 引脚数：3
- 封装尺寸：2.9mm x 1.3mm x 1.1mm（长×宽×高）
三、主要电气特性
IRLML2502TRPBF 的主要电气特性包括：
- V_DS（漏源电压）：最大为 20V
- I_D（漏电流）：最大为 3.7A（@ V_GS=10V）
- R_DS(on)（导通电阻）：最低为 0.077Ω（@ V_GS=10V）
- 门电压（V_GS）：逻辑电平驱动，最低可用 1.8V 进行有效驱动。
这些特性使得 IRLML2502TRPBF 能够在较小的电流和电压条件下有效工作，能满足大部分低功耗设备的需求，例如移动设备、嵌入式系统和便携式电子产品。
四、应用场景
IRLML2502TRPBF 可应用于以下领域：
开关电源：
- 该 MOSFET 可用于高效的电源管理，尤其在 DC-DC 转换器以及线性稳压器中。
负载开关：
- 在各类负载驱动电路中，可以作为开关来控制电流，从而实现有效的负载管理。
信号调理：
- 适用于模拟信号放大和调理，能够在对信号具有高线性要求的应用中提供良好的性能。
移动设备：
- 由于其小型化的特性，特别适合用于智能手机、平板电脑等便携式设备上。
工业控制：
- 在自动化设备和工业控制电路中，也常常使用这类 MOSFET 作为开关元件以提高系统的响应速度。
五、优点和特点
- 低导通电阻：可以显著降低功耗和热量，提高设备的整体效率。
- 快速开关速度：响应时间快，适合高频操作，能有效提高系统的工作效率。
- 逻辑级驱动：可以在较低门电压下运行，不需要额外的驱动电路，简化设计。
- 良好的热性能：具备优良的散热能力，能够承受较大的电流而不至于过热，保证了产品的可靠性。
六、结论
IRLML2502TRPBF 是一种性能优异且应用范围广泛的 MOSFET，适合各种低电压、小功率的电子产品。通过其优良的电气特性和 SOT-23 封装设计，它能够以更高的效率和更小的空间满足现代电子产品的需求。随着电子设备向着更小型、更高效的方向发展，IRLML2502TRPBF 将继续在诸多应用领域中扮演重要角色。
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