WMSIC Electronic Components

TECH PUBLIC SN74LVC1G08DBVR

ModelSN74LVC1G08DBVR
PackageSOT-23-5
BrandTECH PUBLIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TECH PUBLIC SN74LVC1G08DBVR
Type
TECH PUBLIC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TECH PUBLIC
Electronic Component
SN74LVC1G08DBVR
Electronic Component
1
Package
SOT-23-5
Electronic Component
Logic Gate
Electronic Component
74LVC
Electronic Component
0.036g
Electronic Component
1
Channel Count
2
Features
Electronic Component
Electronic Component
BM0264777494
Operating Temperature
40℃~+125℃
Operating Voltage
1.65V~5.5V
Logic Type
and Gate
Current(IOH)
24mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SN74LVC1G08DBVR 产品概述

一、产品简介

SN74LVC1G08DBVR 为 TECH PUBLIC(台舟电子)推出的单片 2 输入与门器件,逻辑功能为 Y = A × B。器件属于 74LVC 系列,工作电压范围宽(1.65V ~ 5.5V),适合多电平系统的逻辑接口与组合逻辑实现,封装为 SOT-23-5,适合空间受限的便携和消费类电子产品。

二、主要特性

  • 逻辑类型:2 输入与门(Y = A × B)
  • 工作电压:1.65V ~ 5.5V,支持低压与常规 3.3V/5V 系统
  • 静态电流(Iq):典型 10 µA,适合低功耗应用
  • 驱动能力:输出拉/灌电流 IOH/IOL = 24 mA,满足一定负载能力
  • 温度范围:-40 ℃ ~ +125 ℃,适用于工业级温度环境
  • 功能特性:具备掉电保护(局部关断模式),在掉电或部分电源条件下可防止器件损坏或反向电流

三、封装与引脚

封装:SOT-23-5(小型化封装,利于高密度 PCB 布局)。该封装在便携设备与模块化电路设计中常用,便于自动贴片生产与散热管理。

四、典型应用场景

  • 低功耗便携设备的逻辑门实现
  • 电平兼容的信号门控与组合逻辑单元
  • 工业控制与传感器接口中需要宽电压范围的逻辑判断
  • 通用数字电路、门控开关与片选逻辑

五、设计与使用建议

  • 建议在 VCC 引脚附近放置 0.1 µF 陶瓷去耦电容,以降低电源噪声对逻辑阈值的影响。
  • 若系统存在热插拔或局部供电场景,可利用器件的掉电保护特性,但仍应遵循系统电源顺序规范以避免异常工作。
  • 在驱动大电容负载或长线时,关注上升/下降沿以及可能的反射,必要时增加串联阻抗或缓冲级。
  • SOT-23-5 封装焊接工艺需控制回流曲线,确保可靠连接与长期稳定性。

六、总结

SN74LVC1G08DBVR 以宽工作电压、低静态功耗和较强输出驱动能力为特点,适用于需要小封装、低功耗且可靠的与运算场合。其掉电保护功能提高了在复杂供电环境下的系统鲁棒性,是嵌入式与工业级设计中常用的基础逻辑器件选择。若需更详细的电气参数与时序特性,请参考器件完整规格书并在实际设计中进行验证。

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