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TECH PUBLIC BAT30F4
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TECH PUBLIC BAT30F4
- Type
- TECH PUBLIC
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TECH PUBLIC
- Electronic Component
- BAT30F4
- Electronic Component
- 1
- Package
- 0201
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.008g
- Electronic Component
- 1
- Electronic Component
- BM0265216495
- Current
- 300mA
- Diode
- 1
- Current(Ir)
- 700nA@30V
- (Vf)
- 500mV@10mA
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
- Voltage Rating(Vr)
- 30V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BAT30F4 — TECH PUBLIC (台舟电子) 0201 封装肖特基二极管 产品概述
一、产品概述
BAT30F4 是台舟电子（TECH PUBLIC）推出的一款超小型0201封装肖特基整流二极管。该器件在10mA电流下正向压降仅约0.5V，结合30V的直流反向耐压与300mA的整流电流能力，使其在空间受限且需兼顾效率与快速响应的电子系统中表现出色。非重复峰值浪涌电流可达4A，满足瞬态冲击场合的保护与整流需求。
二、主要特性
- 低正向压降：VF ≈ 0.5V @ 10mA，降低整流损耗，提升系统能效。
- 合理的耐压能力：直流反向耐压 Vr = 30V，适合多数低压电源与信号链路。
- 低漏电流：反向电流 Ir = 700nA @ 30V，有利于节能及高阻抗节点应用。
- 紧凑封装：0201 超小体积，便于高密度布局与便携设备设计。
- 良好的浪涌承受力：Ifsm = 4A（非重复峰值），可应对短时冲击电流。
三、典型电气参数（关键值）
- 正向压降 VF：500mV @ 10mA
- 直流反向耐压 Vr：30V
- 最大整流电流（平均）：300mA
- 反向电流 Ir：700nA @ 30V
- 非重复峰值浪涌电流 Ifsm：4A
四、主要应用场景
- 便携式电源与电池管理：用于低压差整流、反向保护与电源路径选择。
- 高频开关电路：得益于肖特基特性，适用于快速开关与降低恢复损耗的场合。
- 电源转换器：在输入整流或同步整流辅助路径中可提升效率并节约空间。
- 信号整流与保护：适合对泄漏与导通电压有要求的小信号或混合信号电路。
五、封装与布局建议
0201 封装体积极小，对贴装精度和回流工艺有较高要求。建议：
- 按照厂家推荐的焊盘尺寸设计 PCB，确保焊膏印刷均匀。
- 元件靠近热源或高电流路径时注意热管理，虽为低功耗器件但小封装限制了散热能力。
- 对于高频或高电流路径，尽量缩短走线并增大铜厚以降低寄生阻抗。
六、可靠性与使用注意事项
- 峰值浪涌电流为非重复值，不能作为连续工作电流使用；设计时应保证长期平均电流低于额定整流电流以防过热。
- 在高温或长时间高反向电压条件下，反向漏流可能随温度上升，应评估在目标工况下的漏电影响。
- 焊接与回流时遵循IPC及装配工艺规范，控制热剖面以避免0201封装应力与位移。
七、设计建议总结
BAT30F4 以其低VF、低漏电、30V耐压与超小0201封装，适合在尺寸受限且需高效整流的现代电子产品中使用。选型时应关注实际工作电流、瞬态浪涌次数与回流工艺，合理布局以兼顾电性能与装配可靠性。若需替代或并联使用，务必匹配正向特性与热能力，保证系统稳定运行。
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