WMSIC Electronic Components

TECH PUBLIC SI2308BDS

ModelSI2308BDS
PackageSOT-23
BrandTECH PUBLIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TECH PUBLIC SI2308BDS
Type
TECH PUBLIC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TECH PUBLIC
Electronic Component
SI2308BDS
Electronic Component
1
Package
SOT-23
Electronic Component
1 N
Electronic Component
MOSFET
Electronic Component
0.029g
Electronic Component
1
Electronic Component
BM0264935508
Power Dissipation(Pd)
350mW
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
60V
Capacitor(Ciss)
247pF
Output Capacitor(Coss)
34pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SI2308BDS 产品概述

一、产品简介

SI2308BDS 是一款来自 TECH PUBLIC(台舟电子) 的增强型 N 沟道 MOSFET,采用 SOT-23 小封装设计。器件额定漏源电压为 60V,适用于中低功率、高效率电源管理与充电类应用,兼顾低导通损耗与快速开关性能,便于在空间受限的消费电子与便携式设备中实现稳健的功率控制。

二、主要电气参数

  • 漏源电压 Vdss:60 V
  • 连续漏极电流 Id:3 A
  • 导通电阻 RDS(on):105 mΩ @ Vgs = 10 V
  • 最大耗散功率 Pd:350 mW
  • 阈值电压 Vgs(th):2 V(典型)
  • 总栅极电荷 Qg:6 nC @ Vgs = 4.5 V
  • 输入电容 Ciss:247 pF
  • 反向传输电容 Crss:19.5 pF
  • 输出电容 Coss:34 pF
  • 封装:SOT-23

三、性能特点与优势

  • 60V 电压等级满足常见离线/汽车前端及充电设备的耐压需求。
  • 105 mΩ 的 RDS(on)(10V 驱动)在中等电流工况下可提供较低的导通损耗,有利于提升系统效率。
  • 总栅极电荷较小(6 nC @4.5V),配合较低的输入电容,可实现较快的开关速度并降低驱动能耗,适合高频开关应用。
  • SOT-23 小封装便于在空间受限的布局中使用,适合批量化生产与小型功率模块集成。

四、典型应用场景

  • 充电器与电源管理模块(开关元件、负载开关)
  • DC-DC 降压/升压转换器中作为低端开关或需要外部驱动的高端开关
  • 便携设备与消费电子的小功率电源控制
  • 逆向电流保护、电池管理与电源选择电路(需考虑驱动与功耗)

五、使用建议与注意事项

  • 驱动:为达成标称 RDS(on),建议采用接近 10 V 的栅极驱动;在 3.3 V 或 5 V 逻辑驱动下需确认实际导通电阻与损耗是否满足设计。
  • 热管理:器件 Pd 为 350 mW,SOT-23 封装限制了散热能力,建议使用尽量大的 PCB 铜箔面积导热,必要时采用多层板或热过孔。
  • 布局:栅极布线应尽量短以降低寄生电感,漏极铜箔应尽量扩大并靠近器件以利散热;在开关节点并联足够旁路电容以抑制电压尖峰。
  • ESD/安全:在装配与调试过程中注意静电保护,避免超过器件最大栅源电压与瞬态浪涌。

六、局限性说明

  • 封装与功率限制:SOT-23 的功耗与连续电流能力受限,长时间大电流应用需评估温升并考虑更大封装。
  • 逻辑电平驱动:Vgs(th) ≈ 2 V,但该阈值并不等同于完全导通,若仅以 3.3 V 驱动可能无法获得标称 RDS(on),建议在设计阶段测量实际导通损耗。

总结:SI2308BDS 在 60V 电压等级下以小体积和适中的导通电阻、较低的栅极电荷提供了一个平衡的方案,适合充电设备、电源管理与空间受限的高效率电子系统。设计时应重视驱动电压与散热布线,以充分发挥器件性能。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.