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TWGMC SS52 Schottky Diode SS52
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TWGMC SS52
- Type
- TWGMC
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TWGMC
- Electronic Component
- SS52
- Electronic Component
- 1
- Package
- SMA(DO-214AC)
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.094g
- Electronic Component
- 1
- Electronic Component
- BM0227688456
- Current
- 5A
- Diode
- Electronic Component
- Current(Ir)
- 500uA
- (Vf)
- 550mV@5A
- Electronic Component
- 50℃~+125℃
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SS52 肖特基二极管（TWGMC 台湾迪嘉）产品概述
一、产品简介
SS52 为独立式肖特基整流二极管，厂家：TWGMC（台湾迪嘉），封装为 SMA（DO-214AC）。此器件面向中高电流整流与保护用途，额定整流电流 5A，直流反向耐压 20V，典型正向压降 0.55V（在 5A 条件下），工作结温范围 -50℃ 至 +125℃，反向漏电流 500μA。体积小、开关速度快、正向压降低，是电源路径与保护电路的常用选择。
二、主要电气参数（关键值）
- 型号：SS52
- 品牌：TWGMC（台湾迪嘉）
- 封装：SMA（DO-214AC）
- 整流电流：5A（连续）
- 反向耐压 Vr：20V
- 正向压降 Vf：0.55V @ 5A
- 反向电流 Ir：500μA（标称）
- 工作结温：-50℃ ~ +125℃
三、主要特性与优势
- 低正向压降：在大电流条件下仍保持较低 Vf，可降低整流损耗和发热，提高效率。
- 快速恢复、开关损耗低：肖特基特性使其在开关电源与高频整流场合表现优异。
- 宽温度适应性：工作结温下限低、上限高，适合工业与汽车周边温度变化较大的环境。
- 标准封装易安装：SMA 封装适合自动贴装与波峰/回流焊工艺，利于批量生产。
四、典型应用场景
- 开关电源（整流、续流二极管）
- DC-DC 转换器输出整流
- 反向/反接保护电路
- 电池充放电路径、背向保护
- 低压大电流整流场合，如电机驱动、车载电子电源
五、封装与热管理建议
SMA 封装体积小，但在 5A 连续工作时需关注温升与散热。建议在 PCB 设计时：
- 增大焊盘和引脚铜箔面积，用多层铜和焊盘散热通孔改善导热；
- 在高功率工况下做热仰制设计与必要的热仰散热片或铜箔扩展；
- 对热敏感系统做温度仿真与实测，必要时做电流与占空比的降额处理。
六、可靠性与使用注意
- 反向漏电随温度升高会显著增大，设计时应考虑高温工况下的漏电影响；
- 在非稳态脉冲冲击或瞬态过压下，注意是否超出器件峰值反向/正向极限；
- 储存与焊接按通常无铅/有铅焊接规范处理，避免潮湿引起的焊接缺陷。
七、选型与替代
SS52 适合需要 20V 以内、5A 级别整流与保护的场合。若需更高反向耐压或更低正向压降，可考虑更高 Vr 或更低 Vf 的肖特基型号；若环境温度或浪涌要求更严苛，可选用带封装散热或更高额定电流的器件。
如需器件数据手册（详细电气特性、典型曲线、封装尺寸与可靠性测试），建议向 TWGMC 台湾迪嘉索取原厂 Datasheet，以便完成最终电路设计与可靠性评估。
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