WMSIC Electronic Components

TWGMC DTC114EUA Digital Transistor DTC114EUA

ModelDTC114EUA
PackageSOT-323
BrandTWGMC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TWGMC DTC114EUA
Type
TWGMC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TWGMC
Electronic Component
DTC114EUA
Electronic Component
1
Package
SOT-323
Electronic Component
1 NPN
Electronic Component
Digital Transistor
Electronic Component
0.03g
Electronic Component
1
Electronic Component
BM0226536277
Operating Temperature
55℃~+150℃
Resistor
1.2
Resistor
10kΩ
Transistor Type
NPN
Frequency(f T)
250MHz
Power Dissipation(Pd)
200mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

DTC114EUA 产品概述

一、简介

DTC114EUA 为 TWGMC(台湾迪嘉)国产的数字型晶体管(集成基极电阻/分压网络),采用超小型 SOT-323 封装,适合空间受限的低功耗开关应用。器件在低电压与小电流条件下具有稳定的开通特性和可预测的增益,便于与 MCU、逻辑电路或传感器输出直接接口。

二、主要电气参数(典型/在特定测试条件下)

  • 直流电流增益 hFE:30(测试条件 IO=5mA,VCC=5V)
  • 集-射极击穿电压 VCEo:50V
  • 导通输出电压 VO(on):约 300mV(IO=10mA)
  • 最小输入电压 VI(on):约 3V(对应 IO=10mA);在极低驱动电流下可低至约 0.3V(取决测试条件)
  • 最大输入电压 VI(off):约 500mV(Iin=100µA,VCC=5V)
  • 输入电阻:13kΩ(器件内部集成)
  • 输入端电阻比率:1.2(内部阻值配比,影响输入阈值与偏置)
  • 耗散功率 Pd:200mW
  • 工作温度范围:-55℃ ~ +150℃

注:上述参数受测试条件影响,设计时请以完整规格书中的典型值与极限值为准。

三、功能特点

  • 内置输入电阻(13kΩ),便于与微控制器、TTL/CMOS 等直接相连,减少外部元件。
  • SOT-323 超小封装,适合高密度 PCB 布局与便携式设备。
  • 较高的 VCEo(50V)提供了良好的耐压裕度,可用于较高电压侧的开关控制(在功率和安全限值内)。
  • 宽温度范围,适合工业级环境。

四、典型应用场景

  • MCU/逻辑信号到继电器、小型电磁阀或指示 LED 的驱动放大与开关。
  • 电平移位与接口缓冲(当外部驱动能力有限时)。
  • 便携式、消费类电子以及工业控制中的通断与保护电路。
  • 低功耗电路中的软启动或信号整形。

五、使用建议与注意事项

  • 功率耗散限制:SOT-323 封装的 Pd 为 200mW,导通电流与封装散热限制须在 PCB 布局阶段考虑;若连续工作电流较大,应评估结温与散热。
  • 输入门槛:VI(on) 随负载电流变化明显,设计时根据目标 IO 选择合适的驱动电平以保证可靠开通。
  • 热稳定性与旁路:在高开关频率或高环境温度下注意器件结温提升,必要时采用散热铜箔或降额使用。
  • ESD 与焊接:采用常规静电防护措施;SOT-323 小封装在回流焊时请遵循厂商推荐的温度曲线。

六、封装与采购

  • 封装:SOT-323(超小型 3 引脚)
  • 品牌:TWGMC(台湾迪嘉)
    在选型与采购前,建议索取并阅读器件的完整数据手册(datasheet),以获取引脚定义、极限参数、典型特性曲线及推荐焊接与应用电路图。

若需,我可帮你整理该器件的典型等效电路、推荐的 PCB 布局注意事项或根据你的负载条件计算具体的安全工作点。

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