WMSIC Electronic Components

TWGMC DTC114EE Digital Transistor DTC114EE

ModelDTC114EE
PackageSOT-523
BrandTWGMC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TWGMC DTC114EE
Type
TWGMC
Minimum package
3000 卷

Technical parameters

Electronic Component
TWGMC
Electronic Component
DTC114EE
Electronic Component
1
Package
SOT-523
Electronic Component
1 NPN
Electronic Component
Digital Transistor
Electronic Component
0.03g
Electronic Component
1
Electronic Component
BM0226165991
Operating Temperature
55℃~+150℃
Resistor
1.2
Resistor
13kΩ
Transistor Type
NPN
Frequency(f T)
250MHz
Power Dissipation(Pd)
200mW
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

DTC114EE 产品概述

一、概述

DTC114EE 是台湾品牌 TWGMC(台湾迪嘉)推出的一款小封装 NPN 数字晶体管(带内置偏置电阻),封装为极小型 SOT-523,适合对体积和成本有严格要求的开关应用。器件将基极限流/偏置电阻集成在芯片内,可直接与逻辑信号驱动,简化外部电阻网络,适合高速/批量贴片应用。

二、主要特性

  • 直流电流增益 hFE ≈ 30(在 Ic = 5mA、VCE = 5V 条件下典型值)
  • 集射极击穿电压 Vceo = 50V,支持较高电压的开关场合
  • 集电极电流 Ic 最大 100mA,适合中低功率负载驱动
  • 输出饱和电压 VO(on) ≈ 300mV(在规定测试条件下),开关损耗低
  • 内置电阻比率约 1.2,用于输入限流与偏置
  • 输入电阻约 13kΩ,便于与高阻抗驱动源配合
  • 最小导通输入电压 VI(on) ≈ 3V,关断时输入电压最大 VI(off) ≈ 500mV
  • 耐温范围宽:-55℃ ~ +150℃
  • 最大耗散功率 Pd = 200mW(受 SOT-523 封装热阻限制)

三、典型应用场景

  • 单片机/逻辑门直接驱动小继电器、指示灯、光耦输入或小型电机驱动器
  • 电平转换与低端开路开关(与外部电阻或去耦电路结合)
  • 消费类电子、便携设备、通信终端以及空间受限的工业控制板

四、使用建议与注意事项

  • 由于器件采用 SOT-523 超小封装,热性能有限,Pd = 200mW,在高占空比或持续大电流(接近 100mA)时需注意热量管理与热降额;建议在 PCB 设计中增加散热铜箔或降低连续载流量。
  • VI(on) 最小约 3V,表示器件在 3V 及以上逻辑电平时能可靠导通;在 1.8V 或更低电平系统中可能无法充分驱通,需评估或选用低阈值型号。
  • 输入端已集成偏置/限流电阻(比率约 1.2,输入电阻 ~13kΩ),通常无需外接基极限流电阻,但若外部环境或逻辑电压超过规格,仍建议在输入端并联保护或限流设计以防误烧。
  • 输出饱和电压约 300mV,在设计电源裕量时应考虑此压降对负载的影响。

五、封装与焊接建议

  • 封装:SOT-523(小型化表贴),适用于 0201/0402 尺寸周边器件密集布线的场合。
  • 焊接:推荐使用回流焊,按厂家回流曲线及无铅工艺参数进行;避免长时间高温暴露以保护内部电阻稳定性。
  • PCB 布局:为改善热散逸,建议在器件下方和引脚附近保留适量铜箔并与地/散热层通过过孔连接。

六、结论

DTC114EE 是一款面向体积受限、需直接逻辑驱动的小功率数字晶体管产品。其内置偏置电阻、低饱和电压和宽温度范围使其在便携与嵌入式系统中具有较强的适用性。但需注意 SOT-523 的热性能限制和最小导通电压的要求。在 3V ~ 5V 逻辑系统、开关小负载的场景下,DTC114EE 提供了简洁、低成本且易于贴片的解决方案。

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