Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TWGMC DSK16 Schottky Diode DSK16
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- TWGMC DSK16
- Type
- TWGMC
- Minimum package
- 3000
Technical parameters
- Electronic Component
- TWGMC
- Electronic Component
- DSK16
- Electronic Component
- 1
- Package
- SOD-123FL
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.044g
- Electronic Component
- 1
- Electronic Component
- BM0265826642
- Current
- 1A
- Diode
- Electronic Component
- Current(Ir)
- 500uA
- (Vf)
- 700mV@1A
- Electronic Component
- 55℃~+125℃
- Electronic Component
- 3000
- Voltage Rating(Vr)
- 60V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
DSK16 肖特基二极管产品概述
一、产品核心身份定位
DSK16是台湾迪嘉（TWGMC）推出的独立式肖特基整流二极管，属于低压小功率功率器件系列，专为小型化电子设备的整流、续流等核心场景设计。产品兼顾低功耗、高可靠性与紧凑尺寸，适配消费类电子、工业控制等多领域的应用需求。
二、关键电气参数详解
DSK16的核心参数明确了其性能边界与适用场景，具体如下：
- 正向压降（Vf）：700mV（@1A）——肖特基二极管典型低压降特性，相比普通硅整流管压降降低约30%，可有效减少电路功耗，提升系统能效；
- 直流反向耐压（Vr）：60V——满足12V、24V等低压电源系统的反向耐压需求，避免电路反向击穿；
- 整流电流（IF）：1A——持续稳定的整流能力，支持小功率负载（如LED、微型电机）的供电需求；
- 反向漏电流（Ir）：500μA——反向漏电流控制在较低水平，减少待机功耗，提升电路稳定性；
- 工作结温范围：-55℃~+125℃——覆盖宽温环境，可应用于高低温交替的工业场景或户外便携设备。
三、封装特性与优势
DSK16采用SOD-123FL表面贴装封装，具备以下实用特性：
- 小型化设计：封装尺寸紧凑（约2.5×1.2mm），适配高密度PCB布局，满足手机配件、小型家电等便携化需求；
- 散热优化：封装结构强化了热传导路径，可快速散发布尔热效应产生的热量，提升器件长期可靠性；
- 生产兼容性：表面贴装工艺适配自动化生产，降低批量制造的人工成本与不良率。
四、典型应用场景
基于参数与封装特性，DSK16主要应用于以下场景：
- 低压开关电源：如手机充电器、小型适配器的整流电路，利用低Vf降低待机功耗；
- DC-DC转换器：作为续流二极管，配合MOS管实现高效能量转换（如12V转5V电源模块）；
- LED驱动电路：小功率LED照明（如台灯、夜灯）的整流或续流，提升驱动效率；
- 小型家电控制板：豆浆机、加湿器等设备的电源整流，适应家庭环境的宽温波动；
- 工业控制模块：低功率信号调理电路的整流、钳位应用，满足-55℃~+125℃的宽温需求。
五、品牌与可靠性说明
TWGMC（台湾迪嘉）是专注于功率半导体的制造厂商，DSK16遵循工业级器件标准：
- 采用成熟肖特基工艺，确保批量生产的参数一致性；
- 通过温度循环、湿度老化等可靠性测试，满足长期工作需求；
- 封装符合RoHS环保要求，适配绿色电子产品设计。
总结
DSK16作为一款低功耗、小封装的肖特基二极管，在低压小功率整流、续流场景中平衡了能效、尺寸与可靠性，是消费类电子、工业控制等领域的实用选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
