WMSIC Electronic Components

TWGMC US1M Fast Recovery Rectifier US1M

ModelUS1M
PackageSMA
BrandTWGMC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TWGMC US1M
Type
TWGMC
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TWGMC
Electronic Component
US1M
Electronic Component
1
Package
SMA
Electronic Component
Fast Recovery / High-Efficiency Diode
Electronic Component
0.103g
Electronic Component
1
Electronic Component
BM0226536262
Current
1A
Diode
1
Current(Ir)
5uA
(Vf)
1.65V@1A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
2000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

US1M 快恢复/高效率二极管(SMA)——产品概述

一、产品简介

US1M 是一款独立式快恢复整流二极管,适用于需要较高耐压与快恢复特性的整流或自由轮回回路。品牌:TWGMC(台湾迪嘉),封装为SMA,工作结温范围宽(-55℃ ~ +150℃),单只整流电流1A,兼顾体积与热性能,适合中等功率密度应用。

注:给定信息中存在反向耐压(Vr)值的描述差异(基础参数列出100V,而描述处提到1kV)。本文为便于工程选型,以型号US1M常见含义和描述中的“1kV”作为参考耐压(1000V)进行说明;若实际器件为100V等级,请以实际出货数据表为准。

二、主要技术参数

  • 二极管配置:独立式
  • 正向压降(Vf):1.65V @ 1A
  • 整流电流(If):1A(连续)
  • 非重复峰值浪涌电流(Ifsm):30A(非重复,具体测量条件请参照厂方数据表)
  • 直流反向耐压(Vr):1kV(备注见上文)
  • 反向电流(Ir):5 μA(常温)
  • 反向恢复时间(Trr):75 ns
  • 工作结温范围(Tj):-55℃ ~ +150℃
  • 封装:SMA(表面贴装)

三、性能特点与优点

  1. 快恢复特性:Trr 约75ns,显著降低开关瞬态的能量损耗与回流尖峰,相较普通整流二极管在高频开关场合有更低的开关损耗。
  2. 较低正向压降:1.65V@1A,在相同电流下有助于降低导通损耗和系统发热。
  3. 高阻断能力:1000V 级别耐压(若按描述),适合高压整流、逆变与高压电源应用。
  4. 低漏电流:5 μA(常温)有利于高压下的静态性能和能效表现。
  5. SMA 封装:体积小、易于自动贴装,适合空间受限的中等功率板级设计。

四、典型应用场景

  • 开关电源(SMPS)输出整流或续流二极管
  • 功率因数校正(PFC)电路中高压段整流
  • 逆变器与变频器的高压自由轮回二极管
  • 电池充电器、高压直流链路以及工业电源保护电路
  • 需要在较高电压和中等开关频率下工作、同时要求快速恢复的场合

五、封装与热管理建议

  • SMA 封装热阻相对较大,建议在 PCB 设计上使用加大焊盘、连接铜箔和过孔散热(多孔下板铜)来降低结温。
  • 在连续1A工作和较高环境温度下,应进行结温计算并适当降额以保证长期可靠性。
  • 浪涌(Ifsm)能力通常以半波整流波形测试,实际应用中若存在高能浪涌(例如大电容充电瞬态),应评估峰值能量并视情况增加滤波或限流措施。

六、选型与使用注意事项

  • 核实耐压等级:确保所选具体物料的Vr与系统最高工作电压有足够裕量(通常取安全系数≥1.5)。
  • 注意回恢复引起的电压尖峰与EMI:对于高开关速度的应用,建议配合RC缓冲、熔断器或TVS做过压保护与抑制。
  • 并联使用需谨慎:若为增大电流采用并联,需匹配器件电气特性并考虑均流机制。
  • 温度影响:Vf 随温升略降,但结温升高会降低器件寿命,设计时应考虑热降额。

七、总结

US1M(SMA封装)为一款面向高压整流与快恢复需求的实用二极管,兼顾较高耐压、快回复时间与适中正向压降,适合SMPS 输出、逆变或高压整流场合。选型时请以厂家最终数据表为准,结合系统电压、浪涌能力与散热条件进行热、电综合评估,以确保长期稳定可靠运行。若需要,我可根据你的系统电压、工作频率与PCB散热条件,帮助做更具体的选型与热设计建议。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.