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TWGMC S1G Rectifier Diode S1G
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TWGMC S1G
- Type
- TWGMC
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TWGMC
- Electronic Component
- S1G
- Electronic Component
- 1
- Package
- SMA
- Electronic Component
- General Purpose Diode
- Electronic Component
- 0.092g
- Electronic Component
- 1
- Electronic Component
- BM0226536211
- Current
- 1A
- Diode
- Electronic Component
- Current(Ir)
- 5uA
- (Vf)
- 1.1V@1A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 2000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
S1G 产品概述
一、产品简介
S1G 为 TWGMC（台湾迪嘉）出品的独立式通用整流二极管，封装为 SMA，适用于宽压、高可靠性的整流与阻断场合。该器件设计用于直流整流与电路保护，额定整流电流为 1A，反向耐压达 400V，工作结温范围宽（-55℃ 至 +150℃），适应工业级温度要求。
二、主要电气参数
- 整流电流（IF）：1A（连续）
- 正向压降（Vf）：1.1V @ 1A
- 直流反向耐压（Vr）：400V
- 反向电流（Ir）：典型 5μA（在额定 Vr 条件下）
- 非重复峰值浪涌电流（Ifsm）：30A（短时浪涌能力）
- 工作结温范围：-55℃ ~ +150℃
三、主要特点
- 通用性强：1A/400V 的额定值覆盖多数小功率电源与整流需求。
- 耐热性能好：-55℃~+150℃ 的结温范围适合工业及高温环境。
- 瞬态能力优良：30A 的峰值浪涌电流有助于承受开机或负载突变导致的冲击电流。
- 低漏电：反向电流约 5μA，有利于高阻态下的低功耗要求。
- 封装可靠：SMA 适合自动贴装，利于批量生产与抗机械应力。
四、典型应用场景
- 开关电源输入整流、次级整流或反向保护。
- 适配器、充电器、小型功率模块的整流与续流。
- 灯具驱动、电机控制中的保护与续流回路。
- 通用工业电子设备、家电、仪表等需要 1A 级整流的场合。
五、封装与热管理建议
SMA 为表面贴装封装，易于自动化装配。根据 Vf=1.1V@1A，器件在满载时功耗约 1.1W，长期工作需关注结温上升。建议：
- 在 PCB 上增加焊盘铜箔面积并连接热铜，以降低结到环境的热阻。
- 若连续接近 1A 工作，考虑在 PCB 走宽铜线或散热片以保证可靠性。
- 设计时按最大结温不超过 150℃ 留有安全裕度。
六、安装与注意事项
- 遵循元器件回流焊工艺规范，避免超出封装和内部材料允许的峰值温度；焊接后推荐检测焊点可靠性。
- 避免长期在最大额定电压与高温同时工作，否则会加速漏电与老化。
- 浪涌保护仅为短时能力（Ifsm），频繁或重复的大浪涌需另加限流或保护措施（如保险丝、NTC、浪涌吸收器等）。
七、选型与替代建议
S1G 适合需要 1A、400V 等级且对封装、温度有一定要求的场合。若需更低正向压降或更高频率响应，可考虑肖特基或快恢复二极管；若需更高耐压或更大电流，应选用额定更高的型号。采购时建议核对 TWGMC 的规格书以确认详细机械尺寸与温升曲线，便于 PCB 与热设计匹配。
综上，S1G 以其稳健的电气特性与通用的 SMA 封装，适合作为中小功率整流与保护器件在多种工业与民用电子设备中的应用。
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