WMSIC Electronic Components

TOREX XC6223H181MR-G LDO Regulator XC6223H181MR

ModelXC6223H181MR-G
PackageSOT-25-5
BrandTOREX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TOREX XC6223H181MR-G
Type
TOREX
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
200mV@(300mA)
Electronic Component
TOREX
Electronic Component
XC6223H181MR-G
Electronic Component
1
Package
SOT-25-5
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.04g
Electronic Component
1
Features
Output
Electronic Component
BM0258765330
Operating Temperature
40℃~+105℃@(Ta)
Operating Voltage
5.5V
Output
Electronic Component
Output Voltage
1.8V
Output Current
300mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XC6223H181MR-G 产品概述

一、产品简介

XC6223H181MR-G 是 TOREX(特瑞仕)推出的一款小型线性稳压器(LDO),为固定输出型,输出电压为 1.8V,最大输出电流 300mA。器件采用 SOT-25-5 封装,适合空间受限的表贴(SMD)应用。该款 LDO 以低静态电流与高电源抑制比为设计目标,适合对噪声、纹波敏感且对待机功耗有要求的便携与工业电子设备。

二、主要电气参数

  • 输出类型:固定(1.8V)
  • 工作电压:最大 5.5V(供电输入上限)
  • 输出电流:最大 300mA
  • 压降(Dropout):典型 200mV @ 300mA(低压差,适合电池供电场合)
  • 静态电流 Iq:约 100µA(待机功耗低)
  • PSRR:80dB @ 1kHz(对交流纹波抑制能力强)
  • 输出极性:正极性,单通道输出

三、保护功能与可靠性

XC6223H181MR-G 内置多重保护机制,包括过流保护(OCP)、短路保护(SCP)与过热保护(OTP)。这些保护功能在异常工况(如负载短路或瞬态过流)时自动限制输出或关闭,提升系统可靠性并降低外部保护电路的复杂度。工作温度范围为 -40℃ 到 +105℃(环境温度 Ta),适应多数工业级与消费电子应用。

四、封装与布局建议

  • 封装:SOT-25-5 小型表贴封装,利于高密度布局与自动化贴装。
  • 布线建议:输入与输出电容应尽可能靠近器件引脚放置以确保稳定性与抑制振铃。输出端建议使用低 ESR 陶瓷电容(典型 1µF–10µF,具体参考原厂资料以保证稳定性)。输入侧同样建议配备去耦电容以改善瞬态响应与抑制纹波。

五、热设计与功耗估算

线性稳压器的功耗与温升由 (Vin − Vout) × Iout 决定。例如,当 Vin=3.3V、Vout=1.8V、Iout=300mA 时,器件功耗约为 0.45W。实际系统中需根据 PCB 散热、封装热阻及工作环境评估结壳温度,必要时通过增加散热铜箔或改进布局降低结温以避免触发过热保护。

六、典型应用场景

适用于便携式设备、手持终端、传感器节点、MCU/FPGA/ASIC 的 1.8V 电源、通信模块、射频前端偏置及一般工业控制电源等场景。尤其适合对低噪声与高 PSRR 有要求的模拟或射频应用。

七、选型与注意事项

在选用本器件时,需确认输入电压余量满足最低压差要求;输出电容类型与容量能确保稳压器稳定与良好瞬态响应;并在热设计上留有余量以避免在满载工况下出现热关断。具体引脚定义、电容推荐值与典型特性曲线请参考官方数据手册。

以上为 XC6223H181MR-G 的产品概述与实用建议,便于在设计初期进行功能匹配与热/电方案评估。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.