WMSIC Electronic Components

TOREX XC6701D332PR-G XC6701D332PR

ModelXC6701D332PR-G
PackageSOT-89
BrandTOREX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TOREX XC6701D332PR-G
Type
TOREX
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
360mV@(20mA)
Electronic Component
TOREX
Electronic Component
XC6701D332PR-G
Electronic Component
1
Package
SOT-89
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.128g
Electronic Component
1
Electronic Component
BM0230062579
Operating Temperature
40℃~+85℃@(Ta)
Operating Voltage
28V
Output
Electronic Component
Output Voltage
3.3V
Output Current
150mA
Output Type
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XC6701D332PR-G 产品概述

XC6701D332PR-G 是 TOREX(特瑞仕) 的小型线性低压差稳压器(LDO),为固定输出型 3.3V 线性稳压电源方案。器件以体积小巧的 SOT-89 封装提供,集成过流保护与过热保护,针对低功耗和对电源纹波有一定抑制要求的便携及嵌入式系统提供了一种简单可靠的线性稳压解决方案。

一、主要特性概览

  • 输出类型:固定输出(3.3V)
  • 最大输出电流:150 mA
  • 工作电压(输入端可承受):28 V(详见厂家资料以确认最大额定值)
  • 压差(Dropout):360 mV @ 20 mA(注意:随电流增加压差会增大)
  • 静态电流(Iq):约 50 µA(适合低功耗/待机场景)
  • 电源纹波抑制比(PSRR):约 50 dB @ 1 kHz(对中低频纹波有良好抑制)
  • 保护功能:过流保护(OCP)、过热保护(Thermal shutdown)
  • 输出极性:正极输出
  • 工作温度:-40 ℃ ~ +85 ℃(环境温度 Ta)
  • 封装:SOT-89
  • 通道数:单通道

二、性能与设计要点

  • 低静态电流:50 µA 的静态电流使 XC6701D332 非常适合对静态功耗敏感的电池供电或待机主导设备,可在空闲或低负载状态下延长电池寿命。
  • 压差特性:规格中给出的 360 mV 为 20 mA 工作点的压差指标。设计时需要注意,在更高负载电流(接近 150 mA)时,压差会增大;因此若系统要求在高电流下仍保持 3.3V 输出,输入电压需比 3.3V 高出足够的余量。
  • PSRR:在 1 kHz 处约 50 dB 的抑制能力可有效降低来自开关电源或其他噪声源的中低频纹波干扰,对音频、传感电路等敏感负载有帮助。
  • 保护功能:内部过流和过热保护增强了系统可靠性,防止短路或散热不良时器件和负载受损。但保护机制通常会引起输出进入热限或限流状态,需在系统级别做好容错处理。

三、热管理与功耗考虑

SOT-89 封装的散热能力有限。线性稳压器的功耗主要为 P = (Vin - Vout) × Iout。举例:若输入接近 28 V 且输出电流为 150 mA,则耗散功率将非常大(数瓦级),对 SOT-89 而言会导致器件过热并触发热关断,或长期工作时影响器件寿命与系统可靠性。因此在方案选型与 PCB 设计时应注意:

  • 尽量降低输入与输出间的电压差,或在高压降场合采用前级降压(开关转换器)以减小 LDO 损耗;
  • 在 PCB 布局上为 SOT-89 扩展散热铜箔(大面积 GND 或散热焊盘)以改善散热;
  • 评估在典型工作点下的功耗并验证器件温升,避免长期工作在热关断边界;
  • 对于持续大电流需求,考虑使用更大封装或开关稳压器替代。

四、外部元件与稳定性建议

XC6701D 系列通常对外部输出电容的类型与容值敏感,合适的输出端电容有助于稳定性与瞬态响应。工程实践中常见做法:

  • 使用低 ESR 的陶瓷电容作为输出旁路(典型值可为 1 µF 至数 µF),但最终值与类型应参照厂商 datasheet 的稳定性要求;
  • 在输入端放置适量电容以抑制输入纹波与瞬态,尤其在输入线较长或存在较大干扰时;
  • 在关键应用中进行瞬态回复与稳定性测试,确认在负载突变和不同温度下电压稳定性。

(注:具体电容类型与容值、布线建议请以 XC6701D332PR-G 官方数据手册为准)

五、典型应用场景

  • 电池供电的便携式终端、传感节点、智能家居传感器
  • 工业与仪表电路中为微控制器、传感器或模拟前端供电(在输入电压与功耗可控的场合)
  • 需要低静态电流与中等输出电流的嵌入式设备
  • 对中低频纹波有一定抑制需求的系统

六、总结

XC6701D332PR-G 提供了一个体积小、功能完善的 3.3V 固定 LDO 解决方案,适合低功耗与中等电流的嵌入式与便携应用。其低静态电流、内置过流与热保护及良好的 1 kHz PSRR,使得在合理的输入电压与散热条件下,可以作为可靠的线性稳压选择。对于高压差大电流工况,应重点评估功耗与热设计,必要时采用前级降压或更大散热方案以保障长期可靠性。欲获取完整电气参数、典型应用电路与封装引脚信息,请参考 TOREX 官方数据手册及应用说明。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.