WMSIC Electronic Components

TE Connectivity 3-1827233-6

Model3-1827233-6
PackageBulk
BrandTE CONNECTIVITY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TE Connectivity 3-1827233-6
Type
TE CONNECTIVITY
Minimum package
162 袋

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TE CONNECTIVITY
Electronic Component
3-1827233-6
Electronic Component
1
Package
Bulk
Electronic Component
2
Electronic Component
and Connector
Electronic Component
5.65g
PIN
440P
Electronic Component
1
Electronic Component
BM0264459409
Electronic Component
Electronic Component
Operating Temperature
45℃~+125℃
Electronic Component
Electronic Component
Voltage
50V
Current
500mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

3-1827233-6 产品概述

一、产品简介

TE Connectivity(美国泰科)型号 3-1827233-6 是一款高密度板对板(Board-to-Board)垂直式 PCB 焊接连接器。该连接器为表面贴装(SMT)形式,双排共计 440 针,中心距 0.5 mm(0.02 in),触点镀金,黑色绝缘体,标注为“Free Height”,适用于高速信号传输与高密度互连场景。封装以 Bulk 散装形式供货,适合批量贴装与回流焊工艺。

二、主要电气与机械参数

  • 总针数:440P(双排设计,适合超高针数需求)
  • 安装方式:立贴(垂直式 SMT)
  • 中心距:0.5 mm(0.02 in)
  • 额定电流:500 mA / 针
  • 额定电压:50 V
  • 工作温度范围:-45 ℃ 至 +125 ℃
  • 触头镀层:金(提高接触可靠性与抗氧化性能)
  • 颜色/材质:黑色绝缘体,耐高温工程塑料

三、产品特点与优势

  1. 高密度设计:0.5 mm 中心距与双排 440 针满足紧凑型电子产品对大引脚数的需求,减小 PCB 面积占用。
  2. 金属触点镀金:提供低接触电阻与良好抗氧化能力,适合低电平信号与高可靠性要求的应用场景。
  3. 宽温区适应性:-45 ℃ 至 +125 ℃ 的工作温度覆盖大多数工业与消费电子应用。
  4. SMT 立贴结构:兼容自动贴装与常规回流焊流程,便于现代化生产线集成。
  5. Bulk 包装:便于大批量生产使用,降低单件成本。

四、典型应用场景

  • 各类消费电子、移动设备主板与子板间连接
  • 工业控制模块、嵌入式系统的高密度信号互连
  • 摄像模组、显示模组与主板之间的板对板连接
  • 网络通信设备、存储设备、高速互联应用(作为信号传输端子)

五、设计与装配建议

  • PCB 布局:0.5 mm 中心距要求高精度的焊盘和阻焊设计,建议使用紧密匹配的封装库并考虑锡膏模板优化。
  • 回流焊工艺:支持无铅回流工艺,但需控制温度曲线以保证塑料件与镀层可靠性;建议与 PCB 工艺工程师确认具体曲线。
  • 机械强度:垂直 SMT 的插拔与机械应力需在设计时评估,必要时增加支撑或机械固定结构以降低长期疲劳风险。
  • ESD 与信号完整性:高速信号应用时注意走线阻抗控制与差分对对称性,必要时添加接地屏蔽或地平面策略。

六、可靠性与质量注意点

触头镀金能有效保障长时间接触可靠性,但在高湿或腐蚀环境下仍需考虑环境密封或防护措施。额定 500 mA/针为单针额定值,如需通过大电流,请进行汇流/并联设计并关注发热与散热路径。

七、包装与供应

该型号以 Bulk 散装供货,适合自动化生产线直接取用。批量购买建议与供应商确认最小起订量、交期及可追溯的质量证明文件(如 RoHS/REACH 等合规性资料)。

如需更详细的机械图纸、焊盘推荐或热仿真与可靠性测试数据,可联系 TE Connectivity 官方或器件分销商获取相关资料与支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.